Senior Equipment Technician - Grinding & Bonding Systems

Ams Osram; Malaysia; Hybrid; MYR 60,000 - 120,000; Full time

Job summary

ams OSRAM Opto Semiconductors is seeking a maintenance engineer to implement hardware solutions for grinding, dicing, LLO and bonding processes in a high‑volume manufacturing environment. You will troubleshoot FE machines, perform calibration and preventive maintenance, and ensure material availability and records are kept up to date.

The role requires a minimum diploma in engineering with at least five years in manufacturing maintenance, and proficiency in English and Bahasa Malaysia.

Qualifications

• Min. Diploma or equivalent qualification in engineering.
• Min 5 years experience in manufacturing environment and maintenance engineering.
• Preferably experience in handling grinding/ dicing/ LLO/ Bonding process.
• Able to communicate in English and Bahasa Malaysia.

Responsibilities

• Implements hardware solutions for grinding, dicing, LLO, and bonding processes within manufacturing capabilities.
• Performs troubleshooting and repair of FE machines like dicing, grinding, LLO, bonder and related sub-tools.
• Carrying out calibration and preventive maintenance of machines and equipment.

Skills

Maintenance

Troubleshooting

Grinding

Dicing

Bonding

Education

Diploma in Engineering

Job description

ams OSRAM Opto Semiconductors is seeking a maintenance engineer to implement hardware solutions for grinding, dicing, LLO and bonding processes in a high‑volume manufacturing environment. You will troubleshoot FE machines, perform calibration and preventive maintenance, and ensure material availability and records are kept up to date.

The role requires a minimum diploma in engineering with at least five years in manufacturing maintenance, and proficiency in English and Bahasa Malaysia.