Senior EOL Package SAW Engineer - Precision Dicing & Yield

MVC Resources; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

MVC Resources is recruiting for a Global Semiconductor leader in Melaka to hire an experienced EOL Package SAW Engineer. Reporting to the EOL Section Manager, you will own End-of-Line mechanical dicing, wafer sawing, and package singulation processes, developing parameters and reducing defects.

You will optimize diamond blade parameters and tape processes, manage lamination tension, and support NPIs on DISCO DAD, ACCRETECH/TSK, and K&S platforms, with 8–10 years of front-end experience.

Qualifications

• Bachelor’s Degree in Mechanical, Microelectronics, Manufacturing, or Materials Engineering.
• 8 to 10 years of dedicated semiconductor back-end dicing, wafer sawing, and package singulation experience.
• Expert-level, hands-on experience with mechanical diamond blade dicing equipment platforms (DISCO/TSK systems) and dicing/UV tape material interactions.
• Deep knowledge of silicon micro-cracking mechanisms, blade wear dynamics, kerf alignment verification, and SPC methodology.

Responsibilities

• Own and drive End-of-Line wafer mechanical sawing, package dicing, and singulation process engineering.
• Optimize diamond blade parameters—including spindle RPM, feed rates, cut depth, dress parameters, and cooling water nozzle flow dynamics to eliminate top/backside die chipping, micro-cracks, and sidewall delamination.
• Manage dicing tape selections, UV-release tape irradiation parameters, frame lamination tension, and kerf width controls.
• Drive continuous equipment performance optimization on high-precision dicing platforms (e.g., DISCO DAD, ACCRETECH/TSK, K&S).
• Establish robust SPC controls, line qualification standards, and root-cause containment protocols for new package introductions and thin-wafer singulation.

Skills

Dicing optimization

SPC controls

Diamond blade dicing

Education

Bachelors in Mechanical, Microelectronics, Manufacturing, or Materials Eng

Tools

DISCO DAD

ACCRETECH/TSK

K&S platforms

Job description

MVC Resources is recruiting for a Global Semiconductor leader in Melaka to hire an experienced EOL Package SAW Engineer. Reporting to the EOL Section Manager, you will own End-of-Line mechanical dicing, wafer sawing, and package singulation processes, developing parameters and reducing defects.

You will optimize diamond blade parameters and tape processes, manage lamination tension, and support NPIs on DISCO DAD, ACCRETECH/TSK, and K&S platforms, with 8–10 years of front-end experience.