Staff Engineer, EOL Assembly Process Excellence

Vishay Intertechnology, Inc.

Kampung Krubong

On-site

MYR 120,000 - 180,000

Full time

14 days+

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Job summary

Vishay Semiconductor Malaysia Sdn. Bhd. is seeking a Staff Engineer EOL Assembly Process to lead end-of-line assembly process engineering at Krubong, Melaka, Malaysia. The role focuses on improving quality, yield, and cycle times while supporting new package introductions.

The ideal candidate has 5–10 years in assembly process engineering, hands-on experience with power discrete packages, and a degree in electronics or electrical engineering. Travel may be required.

Qualifications

  • 5–10 years in Assembly Process Engineering with hands-on experience in Power Discrete and/or Power Management Package.

Responsibilities

  • Drive EOL assembly process engineering for Vishay Assembly Production at Subcon.
  • Lead improvement projects to improve quality, yield, hold-lot rate, and disposition cycle time.
  • Support package transfer and new package introductions.
  • Set up, qualify, and implement EOL assembly processes, parameters, and procedures.
  • Review and establish EOL assembly operation baseline specs and procedures.
  • Coordinate with operations to obtain support for engineering evaluations.
  • Define statistical test methods to optimize yield and reduce defects.
  • Review corrective actions for effectiveness and ensure implementation.
  • Support verification/analysis of customer complaints and preventive actions.
  • Report to Subcon Operation Manager.

Skills

English Language
Problem Solving
Communication & Presentation
Be able to Travel Overseas
Under Pressure

Education

Bachelor's or Master's degree in Electronics or Electrical Engineering

Tools

Package Assembly with Cu Clip

Job description

Vishay Semiconductor Malaysia Sdn. Bhd. is seeking a Staff Engineer EOL Assembly Process to lead end-of-line assembly process engineering at Krubong, Melaka, Malaysia. The role focuses on improving quality, yield, and cycle times while supporting new package introductions.

The ideal candidate has 5–10 years in assembly process engineering, hands-on experience with power discrete packages, and a degree in electronics or electrical engineering. Travel may be required.

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