Senior Die Prep Process Engineer – NPI & High-Volume

SanDisk; Batu Kawan; On-site; MYR 150,000 - 190,000; Full time

Job summary

SanDisk in Penang, Malaysia is seeking a Senior Process Module Engineer (Die Prep) to drive new Die Prep processes and equipment solutions from development to high volume manufacturing. The role covers back-grinding, sawing, laser dicing and related qualification activities, setting up new recipes, DOEs and window studies, and ensuring Quality, Cost and UPH targets are met.

Strong problem-solving and cross-functional collaboration are essential.

Qualifications

• Min Bachelor or higher Engineering degree (Electrical Engineering, Mechanical Engineering, etc).
• Min 2-7 years of working experience in Semiconductor Process development.
• Expertise/Experience in Disco machines, Die Prep, an added advantage.
• Knowledge in Semiconductor assembly processes.
• Familiarize with FMEA, SPC, 8D Problem Solving, 6 Sigma certification, Minitab, JMP.
• Knowledge of Design Of Experiment (DOE).
• Innovative, patent disclosure will be an added advantage.

Responsibilities

• Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets (Process Module Engineering) supporting New Product Introduction/Qualification from Development to High volume manufacturing.
• New Die Prep (Wafer Backgrinding, Sawing, Laser Dicing, Stealth Laser Dicing) Process Development for new wafer technology, next generation products, new material qualifications, new machine qualifications and new process qualifications.
• Setup new recipe for Die Prep processes (Back-grinding, mounting, laser groove, mechanical dicing, tape & reel), perform complete window study, DOEs, corner limits.
• Golden recipe setup for new package qualification.
• Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
• Process transfer from Development to New product Introduction team & from site to site.
• Work closely with Cross site's Product development & design team to understand the Package Design Rules & Requirements.
• Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.

Skills

Self-motivated

Initiative

Team leadership

AI/ML knowledge

Education

Bachelor or higher in Engineering

Tools

Minitab

JMP

DOE

Job description

SanDisk in Penang, Malaysia is seeking a Senior Process Module Engineer (Die Prep) to drive new Die Prep processes and equipment solutions from development to high volume manufacturing. The role covers back-grinding, sawing, laser dicing and related qualification activities, setting up new recipes, DOEs and window studies, and ensuring Quality, Cost and UPH targets are met.

Strong problem-solving and cross-functional collaboration are essential.