Die Prep Metrology Engineer for High-Volume Packaging

Intel Corporation; Kulim; On-site; MYR 120,000 - 180,000; Part time

Job summary

Intel Corporation in Kulim, Malaysia seeks a Die Prep Module Engineer focused on Advanced Metrology. You will own metrology tool performance, drive troubleshooting, and improve uptime and process control in a high-volume manufacturing environment.

Join a team delivering advanced packaging solutions, collaborating across Process Engineering, Manufacturing, Automation, and suppliers to deploy new technologies and ramps while maintaining detailed operating procedures and documentation.

Qualifications

• Bachelor’s degree in Electrical, Electronics, Mechanical, Mechatronics, or a related field.
• Knowledge of semiconductor manufacturing processes, preferably in Die Prep/metrology/advanced packaging.
• Experience with SPC, DOE, and FMEA.
• Strong troubleshooting and data-driven problem solving.

Responsibilities

• Own the performance, reliability, and capability of advanced metrology and inspection equipment within the Die Prep module.
• Drive equipment troubleshooting, root cause analysis, and resolution of hardware, software, and automation-related issues.
• Improve tool uptime, productivity, and reliability through preventive maintenance and continuous improvement initiatives.
• Utilize SPC, DOE, FMEA, and data analysis to identify trends and prevent process excursions.
• Partner with Process Engineering, Manufacturing, Automation, and suppliers to support technology transfers, NPI, and ramps.
• Develop and optimize metrology recipes to meet process control and manufacturing requirements.
• Lead equipment installation, qualification, upgrades, and capacity expansion projects.
• Develop and maintain operating procedures, maintenance standards, and troubleshooting documentation.
• Identify and implement innovative metrology and automation solutions to improve yield and factory performance.

Skills

Metrology expertise

Troubleshooting

Data analysis

Cross-functional collaboration

Education

Bachelor’s degree in Electrical, Electronics, Mechanical, Mechatronics, Materials Engineering, or related field

Job description

Intel Corporation in Kulim, Malaysia seeks a Die Prep Module Engineer focused on Advanced Metrology. You will own metrology tool performance, drive troubleshooting, and improve uptime and process control in a high-volume manufacturing environment.

Join a team delivering advanced packaging solutions, collaborating across Process Engineering, Manufacturing, Automation, and suppliers to deploy new technologies and ramps while maintaining detailed operating procedures and documentation.