Semiconductor X-Ray Inspection Equipment Engineer / Manager

Aca Vision Technology Sdn Bhd

Seberang Perai

On-site

MYR 134,000 - 268,000

Full time

14 days+
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Job summary

Aca Vision Technology Sdn Bhd is seeking an experienced X-Ray Inspection Equipment Engineer / Manager to support development, integration and deployment of automated AXI systems for semiconductor applications. The role emphasizes system evaluation, application development and customer support across multiple teams.

Senior candidates will lead projects and coordinate internal teams, suppliers and customers, ensuring successful deployment and optimization of X-ray inspection solutions globally.

Qualifications

  • Bachelor's degree or higher in Electrical, Electronics, Mechatronics, Mechanical, Physics, Imaging Science or related field.
  • Experience in semiconductor equipment and automated X-ray inspection.
  • Knowledge of X-ray imaging principles and detectors.
  • Experience in equipment integration, calibration and troubleshooting.
  • Ability to travel locally and internationally when required.

Responsibilities

  • Develop, integrate and optimize 2D/3D AXI systems for semiconductor products.
  • Evaluate X-ray sources, detectors, motion systems and imaging tech.
  • Define inspection parameters, defect criteria and acceptance limits.
  • Lead engineering projects and coordinate teams, suppliers and customers.
  • Provide technical proposals, evaluation reports and training materials.
  • Support installation, testing, commissioning and customer support.

Skills

X-ray inspection
Semiconductor equipment
Machine vision
AI inspection
Communication skills
Travel willingness

Education

Engineering degree

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

We are seeking an experienced X-Ray Inspection Equipment Engineer / Manager to support the development, integration and deployment of automated X-ray inspection equipment for semiconductor applications. The successful candidate will be responsible for X-ray system evaluation, application development, inspection process optimization, machine integration, technical troubleshooting and customer support. Candidates applying for the Manager position will also lead engineering projects and coordinate internal teams, suppliers and customers.

Key responsibilities

Develop, integrate and optimize 2D X-ray and 3D/CT automated X-ray inspection (AXI) systems for semiconductor products.

Evaluate and select suitable X-ray sources, detectors, motion systems and image-processing technologies.

Develop inspection solutions for semiconductor defects such as die-attach and solder voids, wire-bond defects, die cracks and package cracks, foreign materials and internal contamination, misalignment, insufficient solder and bridging, and lead-frame, copper-clip and internal structural defects.

Conduct sample evaluations, feasibility studies and inspection capability assessments.

Define inspection parameters, image-quality requirements, defect criteria and acceptance limits.

Optimize X-ray voltage, current, magnification, exposure time, projection angle and imaging parameters.

Work with software and vision teams to develop image-processing algorithms, automated defect detection and AI-based inspection functions.

Integrate X-ray systems with material-handling equipment, loaders, unloaders, conveyors, barcode readers and factory automation systems.

Support equipment setup, calibration, testing, troubleshooting, installation and acceptance activities.

Prepare technical proposals, machine specifications, evaluation reports, operating procedures and training materials.

About you

Bachelor's degree or higher in Electrical Engineering, Electronics Engineering, Mechatronics, Mechanical Engineering, Physics, Imaging Science or a related field.

Relevant experience in semiconductor equipment, automated X-ray inspection, industrial X-ray imaging, machine vision or automated inspection systems.

Good understanding of X-ray imaging principles, including X-ray sources, flat-panel detectors, geometric magnification, image contrast and image resolution.

Knowledge of semiconductor assembly processes, such as die attach, wire bonding, soldering, sintering, molding, clip bonding or advanced packaging.

Experience in equipment integration, machine setup, calibration, process optimization and technical troubleshooting.

Ability to analyze X-ray images and establish reliable defect-detection criteria.

Strong analytical, problem-solving and communication skills.

Able to communicate effectively in English. Mandarin or Bahasa Malaysia proficiency will be an advantage.

Willing to travel locally and internationally when required.

Engineer: Minimum 3 years of relevant engineering experience. Senior Engineer: Minimum 5 years of relevant experience, preferably involving semiconductor inspection equipment. Manager: Minimum 7 years of relevant experience, including project leadership or engineering team management.

Opportunity to participate in the development of advanced semiconductor X-ray inspection equipment.

Exposure to machine vision, AI inspection, automation and semiconductor manufacturing technologies.

Career-development opportunities in technical leadership and engineering management.

Competitive salary and benefits based on qualifications and experience.

Training and opportunities to work with customers and technology partners locally and internationally.

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