Semiconductor Backend Assembly Process Engineer (NPI & Ramp)

Renesas Electronics (Malaysia)

Teluk Panglima Garang

On-site

MYR 90,000 - 150,000

Full time

28 hours ago
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Job summary

Renesas Electronics (Malaysia) is seeking an experienced Process Engineer to develop, optimize, and qualify semiconductor assembly processes for REXFET products, covering resin tie bar cut, strip grinding, and cut form mark.

You will work closely with NPI, Production, Quality Assurance, Equipment, and Product Engineering to ensure smooth transfer to mass production, robust process controls, and meeting cost and reliability targets.

Qualifications

  • Bachelor's Degree in Engineering (Mechanical, Mechatronics, or related).
  • Minimum 5 years experience in semiconductor assembly, packaging, or manufacturing engineering.
  • Experience in multiple assembly processes, power semiconductor or power discrete packaging is advantageous.

Responsibilities

  • Develop, optimize, and qualify assembly processes for REXFET products.
  • Collaborate with NPI, Production, QA, Product Eng, Material Eng, and other cross-functional teams to enable mass production.
  • Define process parameters, specifications, control limits, and acceptance criteria.
  • Review process capability, yield performance, defect trends, and qualification results.
  • Prepare technical reports, process documentation, and qualification summaries.
  • Support safe launch activities and ensure issues are resolved before mass production release.

Skills

Analytical skills
Troubleshooting
DOE knowledge
SPC & FMEA
Data analysis (Excel)
Cross-functional collab

Education

Bachelor's in Engineering

Tools

Microsoft Excel
PowerPoint

Job description

Renesas Electronics (Malaysia) is seeking an experienced Process Engineer to develop, optimize, and qualify semiconductor assembly processes for REXFET products, covering resin tie bar cut, strip grinding, and cut form mark.

You will work closely with NPI, Production, Quality Assurance, Equipment, and Product Engineering to ensure smooth transfer to mass production, robust process controls, and meeting cost and reliability targets.

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