Senior Semiconductor Assembly Process Engineer

Renesas Electronics Corp.; Selangor; On-site; MYR 95,000 - 130,000; Full time

Benefits offered by this job

Competitive benefits package

Job summary

Renesas Electronics Malaysia is seeking an experienced Process Engineer to develop, optimize, and qualify semiconductor assembly processes for REXFET products. You will work on Resin Tie Bar Cut, Strip Grinding, and Cut Form Mark processes, coordinating with NPI, Production, QA, and others to ensure reliable, cost-effective mass production.

The role requires a strong background in DOE, SPC, FMEA, and data analysis, with hands-on experience in marking, trimming, and form processes.

Qualifications

• Bachelor's degree in engineering or related discipline.
• Minimum 5 years in semiconductor assembly, packaging, or manufacturing engineering.
• Experience across multiple assembly processes is preferred.

Responsibilities

• Develop and optimize assembly processes for REXFET products.
• Lead NPI qualification builds, DOE, and process validation.
• Collaborate with cross-functional teams to ensure smooth transfer to mass production.
• Define critical-to-quality parameters and support risk assessments.

Skills

Analytical

Troubleshooting

DOE

SPC

FMEA

Data analysis

Cross-functional

Education

Bachelor's Degree in Engineering

Tools

Keyence Laser Marker

Machine Vision Inspection

Dieset Maintenance

Job description

Renesas Electronics Malaysia is seeking an experienced Process Engineer to develop, optimize, and qualify semiconductor assembly processes for REXFET products. You will work on Resin Tie Bar Cut, Strip Grinding, and Cut Form Mark processes, coordinating with NPI, Production, QA, and others to ensure reliable, cost-effective mass production.

The role requires a strong background in DOE, SPC, FMEA, and data analysis, with hands-on experience in marking, trimming, and form processes.