Senior NPI Process Engineer – Semiconductor Packaging

Renesas Electronics (Malaysia); Teluk Panglima Garang; On-site; MYR 90,000 - 150,000; Full time

Job summary

Renesas Electronics Malaysia is seeking an engineer to develop and optimize semiconductor assembly processes for new products, covering wafers to final assembly cleaning. You will work with NPI, Production, and QA teams to ensure quality, reliability, and cost targets as products enter mass production.

The role emphasizes process development, qualification, and risk mitigation, with opportunities to influence multiple assembly steps and manufacturing transfer.

Qualifications

• Bachelor's Degree in Engineering (Electrical, Electronics, E&E, Mechanical, Mechatronics, Materials, Semiconductor, or related).
• Minimum 5 years experience in semiconductor assembly, packaging, or manufacturing engineering preferred.
• Experience in multiple assembly processes (power semiconductor or power discrete packaging is a plus).

Responsibilities

• Develop, establish, and optimize assembly process conditions for new products.
• Prepare process development plans, qualification builds, and process validation activities.
• Establish process parameters, specs, control limits, and acceptance criteria.
• Review capability, yield trends, defects, and qualification results; prepare reports and summaries.
• Support safe launch and resolve critical issues before mass production.

Skills

Analytical thinking

Troubleshooting

Cross-functional collaboration

Multi-project management

Education

Bachelor's Degree in Engineering

Tools

Excel

PowerPoint

Job description

Renesas Electronics Malaysia is seeking an engineer to develop and optimize semiconductor assembly processes for new products, covering wafers to final assembly cleaning. You will work with NPI, Production, and QA teams to ensure quality, reliability, and cost targets as products enter mass production.

The role emphasizes process development, qualification, and risk mitigation, with opportunities to influence multiple assembly steps and manufacturing transfer.