NPI Semiconductor Assembly Process Engineer

Renesas Electronics Corp.; Selangor; On-site; MYR 90,000 - 150,000; Full time

Benefits offered by this job

Competitive benefits package

Global opportunities

Job summary

Renesas Electronics Corp. is seeking an experienced Process/NPI Engineer to develop and optimize semiconductor assembly processes across wafer mounting, dicing, solder printing, clip bonding, vacuum reflow, and flux cleaning.

You will drive qualification, risk assessment, and process validation for new products before scale-up. Collaborating with Production, QA, Product Eng, and Materials Eng, you will ensure robust process parameters, documentation, and readiness for mass production while

Qualifications

• Bachelor's Degree in Engineering or related disciplines.
• Minimum 5 years experience in semiconductor assembly, packaging, or manufacturing engineering preferred.
• Experience in multiple assembly processes (power semiconductor or power discrete packaging advantageous).

Responsibilities

• Develop, establish, and optimize assembly process conditions for new products.
• Prepare and execute process development plans, engineering & qualification builds, and process validation activities.
• Establish process parameters, specifications, control limits, and acceptance criteria.
• Evaluate process feasibility, identify manufacturing risks, and implement preventive actions before mass production.
• Review process capability, yield performance, defect trends, and qualification results.
• Prepare technical reports, process documentation, and qualification summaries.
• Support safe launch activities and resolve critical process issues before mass production release.

Skills

DOE

SPC

FMEA

Root cause analysis

Data analysis

Cross-functional collaboration

Excel

Education

Bachelor's Degree in Engineering (Electrical, Electronics, E&E, Mechanical, Mechatronics, Materials, Semiconductor)

Job description

Renesas Electronics Corp. is seeking an experienced Process/NPI Engineer to develop and optimize semiconductor assembly processes across wafer mounting, dicing, solder printing, clip bonding, vacuum reflow, and flux cleaning.

You will drive qualification, risk assessment, and process validation for new products before scale-up. Collaborating with Production, QA, Product Eng, and Materials Eng, you will ensure robust process parameters, documentation, and readiness for mass production while