Semiconductor Assembly & Process Tech – FOL & Encapsulation

Globetronics Technology Berhad

Bayan Lepas

On-site

MYR 39,000 - 67,000

Full time

46 hours ago

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Job summary

Globetronics Technology Berhad in Malaysia is hiring a Semiconductor Assembly & Process Technician with hands-on experience in Pick & Place, Dicing, FOL Assembly, Die Bonder, and Encapsulation. The role supports daily production, equipment setup, process troubleshooting and changeovers to keep semiconductor manufacturing operations stable and efficient.

You will operate and monitor equipment per SOPs, assist in NPI, process qualification and product transfers, perform troubleshooting, and

Qualifications

Minimum SPM/Certificate/Diploma in Engineering or related field.

Responsibilities

Operate, set up and monitor assembly and manufacturing equipment per SOPs and work instructions.
Perform Pick & Place, Dicing, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation.
Support FOL assembly processes and ensure production targets and quality requirements are achieved.
Perform equipment setup, product changeover, recipe verification, and parameter checks.
Troubleshoot process and equipment abnormalities and escalate issues to Engineers when required.
Perform basic equipment adjustments and support preventive maintenance activities.
Monitor process parameters, machine performance, product quality, and production output.
Conduct visual inspection and identify defects such as die misalignment, wire defects, voids, delamination, dispensing defects, and assembly-related issues.
Support engineering trials, NPI, process qualification, product transfer, and improvement activities.
Maintain accurate production, process, and equipment records.