Semiconductor Assembly & Process Technician – FOL / Dicing / Encapsulation

Globetronics Sdn. Bhd.

Bayan Lepas

On-site

MYR 67,000 - 123,000

Full time

37 hours ago
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Job summary

Globetronics Sdn. Bhd. is seeking an experienced Semiconductor Assembly & Process Technician in Penang to support daily production, equipment setup, and process troubleshooting.

The role covers Pick & Place, Dicing, FOL Assembly, Die Bonder, DA & Recon, and Encapsulation. You will contribute to process improvements, QA, and product transfers while maintaining records and working in a cleanroom environment. This position requires 1–5 years of relevant experience and a Diploma or Certificate in

Qualifications

  • 1-5 years of hands-on experience in semiconductor, electronics, or manufacturing industry.
  • Experience with Pick & Place, Dicing, FOL Assembly, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, Encapsulation is preferred.
  • Able to work in a cleanroom and shifts, with good teamwork and problem-solving skills.

Responsibilities

  • Operate, set up, and monitor semiconductor assembly and manufacturing equipment according to SOPs and work instructions.
  • Perform hands-on processes including Pick & Place, Dicing, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, Encapsulation.
  • Support FOL assembly processes and ensure production targets and quality requirements are achieved.
  • Perform equipment setup, product changeover, recipe verification, and parameter checks.
  • Troubleshoot process and equipment abnormalities and elevate issues to Engineers when required.
  • Perform basic equipment adjustments and support preventive maintenance activities.
  • Monitor process parameters, machine performance, product quality, and production output.
  • Conduct visual inspection and identify defects such as die misalignment, wire defects, voids, delamination, dispensing defects, and assembly-related issues.
  • Support engineering trials, NPI, process qualification, product transfer, and improvement activities.

Skills

Semiconductor hands-on
Process troubleshooting
Quality consciousness

Education

Diploma or Certificate in Engineering

Tools

Asymtek equipment

Job description

Semiconductor Assembly & Process Technician - FOL / Dicing / Encapsulation

We are seeking an experienced Semiconductor Assembly & Process Technician with hands-on experience in Pick & Place, Dicing, FOL Assembly, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation processes. The successful candidate will support daily production, equipment setup, process troubleshooting, product changeover, and process improvement to ensure stable and efficient semiconductor manufacturing operations.

Key responsibilities

Operate, set up, and monitor semiconductor assembly and manufacturing equipment according to SOPs and work instructions.

Perform hands-on processes including Pick & Place, Dicing, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation.

Support FOL (Front-of-Line) assembly processes and ensure production targets and quality requirements are achieved.

Perform equipment setup, product changeover, recipe verification, and parameter checks.

Troubleshoot process and equipment abnormalities and elevate issues to Engineers when required.

Perform basic equipment adjustments and support preventive maintenance activities.

Monitor process parameters, machine performance, product quality, and production output.

Conduct visual inspection and identify defects such as die misalignment, wire defects, voids, delamination, dispensing defects, and assembly-related issues.

Support engineering trials, NPI, process qualification, product transfer, and improvement activities.

Maintain accurate production, process, and equipment records.

About you

Minimum SPM / Certificate / Diploma in Engineering, Electronics, Mechanical, Mechatronics, Manufacturing, or related field.

1-5 years of hands-on experience in semiconductor, electronics, or manufacturing industry.

Practical experience in one or more of the following processes: Pick & Place, Dicing / Wafer Sawing, FOL Assembly, Die Bonder, DA & Recon, Curing / Cure, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, Encapsulation.

Experience with Asymtek / dispensing or encapsulation equipment is an added advantage.

Good understanding of semiconductor assembly processes and equipment operation.

Able to perform basic machine troubleshooting and process adjustments.

Willing to work in a cleanroom and shift environment.

Good teamwork, discipline, attention to detail, and problem-solving skills.

Machinery & Automation 1,001-5,000 employees

Founded in 1991 by 2 ambitious entrepreneurs, Globetronics has grown rapidly over the last 20 years from one humble 20,000 sq.ft. rented facility to ten buildings covering more than 600,000 sq.ft., with over 2,500 employees.

The major shareholders of Globetronics include Wiserite Sdn. Bhd. and Lembaga Tabung Haji. Globetronics was listed on the Kuala Lumpur Stock Exchange (KLSE 7022 GTRONIC) on 3 November 1997.

Vision

To Be The Global Business Partner of Choice In Niche Products And Services.

Mission

To Deliver Continuous Growth And Breakthroughs In Business Performance With Total Customer Satisfaction.

Belief

People Are Our Greatest Assets

Results Oriented With Customer Satisfaction

Organizational Agility

Integrity At All Times

Team-Based Approach

Founded in 1991 by 2 ambitious entrepreneurs, Globetronics has grown rapidly over the last 20 years from one humble 20,000 sq.ft. rented facility to ten buildings covering more than 600,000 sq.ft., with over 2,500 employees.

The major shareholders of Globetronics include Wiserite Sdn. Bhd. and Lembaga Tabung Haji. Globetronics was listed on the Kuala Lumpur Stock Exchange (KLSE 7022 GTRONIC) on 3 November 1997.

Vision

To Be The Global Business Partner of Choice In Niche Products And Services.

Mission

To Deliver Continuous Growth And Breakthroughs In Business Performance With Total Customer Satisfaction.

Belief

People Are Our Greatest Assets

Results Oriented With Customer Satisfaction

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