Remote Tech & Market Analyst – Semiconductor Packaging

Yole Group; Kuala Lumpur; Remote; MYR 120,000 - 180,000; Full time

Job summary

Yole Group is a global leader in market and technology analysis for semiconductors packaging. The Technology & Market Analyst will cover legacy and advanced packaging trends, collaborating across domains to deliver strategic insights for customers worldwide.

The role requires a strong academic background in semiconductor fields, 3+ years in advanced packaging, and fluent English. Travel to conferences and tradeshows will be periodically necessary.

Qualifications

• Masters or PhD in a semiconductor field is mandatory.
• MBA or double degree would be a real plus.
• 3+ years of experience in advanced packaging is mandatory.
• Strong knowledge of advanced packaging technologies & substrates.
• In-depth knowledge of the microelectronics industry: supply chain & market strategies.
• Good knowledge of data modelling and English at CEFR C1 or IELTS >6.5.

Responsibilities

• Oversee technology and industry insights from legacy packaging to advanced packaging market trends.
• Collect data from different sources according to internal methodologies.
• Understand the impact of new or improved technologies in various applications.
• Execute business, marketing, technology analysis within a given timeframe and budget.
• Create and manage long-term relationships with customers and answer inquiries.
• Promote activities at conferences and dedicated tradeshows.
• Give presentations at international conferences and workshops.

Skills

Semiconductor packaging

Market analysis

Technology analysis

Data modelling

English proficiency

Education

Masters/PhD in semiconductor field

MBA or double degree

Tools

Data modelling

Job description

Yole Group is a global leader in market and technology analysis for semiconductors packaging. The Technology & Market Analyst will cover legacy and advanced packaging trends, collaborating across domains to deliver strategic insights for customers worldwide.

The role requires a strong academic background in semiconductor fields, 3+ years in advanced packaging, and fluent English. Travel to conferences and tradeshows will be periodically necessary.