ENGR STAFF, R&D ENGINEERING; DSGN (SIMULATION ENGINEER)

ON Semiconductor Malaysia Sdn. Bhd.; Seremban; Presencial; MYR 90 000 - 130 000; Tempo integral

Resumo da oferta

ON Semiconductor Malaysia Sdn. Bhd. seeks a Thermo-Mechanical Simulation Engineer to develop and execute simulation methodologies for semiconductor packages and power modules. You will work with design, package development, process reliability and manufacturing teams to accelerate product development and improve performance.

The role requires strong FEA skills, experience with ANSYS and Abaqus, and a collaborative mindset to translate simulations into design improvements.

Qualificações

• Bachelor's, Master's or PhD in Mechanical/Materials/Physics or related field.
• Experience with FEA tools: ANSYS Mechanical, ANSYS Icepak, Abaqus, COMSOL.
• Knowledge of semiconductor packaging, power modules, thermal management and reliability.

Responsabilidades

• Perform thermo-mechanical simulations of semiconductor packages, power modules, and assemblies using FEA.
• Develop models to evaluate thermal performance, stress, warpage, deformation and reliability risks.
• Support material selection by assessing mechanical integrity and thermal behavior.
• Conduct root-cause investigations and failure analysis via simulations.
• Collaborate with design, process, reliability and manufacturing teams to optimize performance.
• Document methods, report findings, and propose design improvements.
• Support technology roadmaps and innovation projects related to advanced packaging.

Conhecimentos

Thermal analysis

Mechanical analysis

Reliability analysis

FEM

Cross-functional collaboration

Formação académica

Bachelor's degree in Mechanical Engineering

Master's degree in related field

Ferramentas

ANSYS Mechanical

ANSYS Icepak

Abaqus

COMSOL

Descrição da oferta de emprego

ENGR STAFF, R&D ENGINEERING; DSGN (SIMULATION ENGINEER)

We are seeking a highly motivated Thermo-Mechanical Simulation Engineer to develop and execute simulation methodologies for semiconductor packages and power modules. The role will focus on thermal, mechanical, and reliability analysis to support new product development, package design optimization, and technology innovation. The successful candidate will work closely with design, package development, process, reliability, and manufacturing teams to accelerate product development and improve product performance.

onsemi(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

• Perform thermo-mechanical simulations and analyses of semiconductor packages, power modules, and electronic assemblies using finite element analysis (FEA) tools.
• Develop simulation models to evaluate thermal performance, stress, warpage, deformation, and reliability risks during product development.
• Support package and material selection by assessing mechanical integrity and thermal behavior under various operating conditions.
• Conduct root-cause investigations and failure analysis through simulation-driven approaches.
• Collaborate with cross-functional teams including package design, product engineering, process development, reliability, and manufacturing to optimize product performance.
• Develop and improve simulation methodologies, modeling techniques, and correlation practices with experimental data.
• Generate technical reports, present simulation findings, and provide recommendations for design improvements.
• Support technology roadmaps and innovation projects related to advanced packaging, power semiconductor devices, and new materials.

Preferred Qualifications

• Bachelor's, Master's, or PhD in Mechanical Engineering, Materials Engineering, Physics, or a related discipline.
• Good experience with FEA tools such as ANSYS Mechanical, ANSYS Icepak, Abaqus, COMSOL, or equivalent.
• Knowledge of semiconductor packaging, power modules, thermal management, reliability, and material characterization.
• Experience correlating simulation results with laboratory measurements and reliability testing.
• Strong analytical, problem-solving, and communication skills.

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