Senior Tooling Engineer

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 120,000 - 160,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Parking

Medical for immediate family members

car subsidy

Job summary

Carsem (M) Sdn. Bhd in Ipoh, Malaysia is seeking a senior technician to coordinate mold tooling PM, verify data, review reports and checklists, and approve procedures.

You will oversee mold refurbishment, sample shots, and strict visual/dimensional inspections to ensure tool readiness. The candidate should hold a degree in Mechanical/Electrical/Mechatronic engineering with 5+ years in semiconductor manufacturing and possess strong analytical and teamwork skills, plus the ability to generate 3D

Qualifications

• Bachelor’s or Master’s degree in Mechanical, Electrical/Electronic, Mechatronic Engineering or related field with at least 5 years in semiconductor manufacturing.
• Strong problem-solving, analytical and troubleshooting skills.
• Excellent communication and teamwork abilities.

Responsibilities

• Coordinate technicians for mold tooling PM, verify measurement data, review PM reports and checklists, and approve PM checklists.
• Work on mold refurbishment, set up new mold parts on housing, obtain sample shots, inspect visually and dimensionally.
• Monitor tool life, audit counters, investigate failures and drive corrective actions.
• Coordinate daily mold tooling issues and establish preventive actions.
• Generate 3D models using 3D software.
• Coordinate special projects linking mold tooling and equipment, and follow up on equipment issues.

Skills

Reading & Interpreting Technical Schem

Electro-Mechanical & Pneumatic Systems

Failure Analysis &Root Cause Investig

3D Modeling Software

Education

Bachelor’s or Master’s Degree in Mechanical, Electrical/Electronic, Mechatronic Engineering

Tools

3D CAD Software

Job description

To coordinate the technician to handle mold tooling PM, verify all PM actual measurement data, review PM report, PM checklist and approve PM checklist.

To work on mold refurbishment, coordinate to set up new mold parts on mold housing, obtain sample shot, perform visual and dimension inspection.

Monitor tool life control on critical mold part. Audit tool life counter in periodic basis. Investigate the mold part in case the mold parts not able to meet tool life.

To coordinate the technician to handle daily mold tooling related issue, carry out the investigation and establish corrective action and preventive action.

Generate 3D model by using 3D software.

To coordinate special project on any issue which correlate between mold tooling and mold equipment

To follow up on mold equipment issue.

Special Skills

Reading & Interpreting Technical Schematics – Ability to follow machine manuals, circuit diagrams, and troubleshooting guides.

Electro-Mechanical & Pneumatic Systems – Knowledge of motors, actuators, vacuum systems, and pressure control.

Failure Analysis & Root Cause Investigation – Using diagnostic tools to identify and address recurring equipment failures.

Having the capability to handle 3D software to generate 3D drawing.

Requirements

Bachelor’s or Master’s Degree in Mechanical, Electrical/Electronic, Mechatronic Engineering, or related field with minimum 5 years of relevant experience, preferably in a semiconductor manufacturing environment.

Strong problem-solving, analytical, and troubleshooting skills.

Excellent communication and teamwork abilities.

Self-motivated, proactive, and capable of thriving in a fast-paced production environment.

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Perks and benefits

• Medical
• Education support
• Dental
• Parking
• Medical for immediate family members
• car subsidy