Head of R&D
Carsem (M) Sdn. Bhd
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Benefits offered by this job
Job summary
Carsem (M) Sdn. Bhd is seeking a senior technology leader to drive strategic initiatives, develop and commercialize advanced technologies, and oversee roadmaps within the Technology Center.
The role involves leading cross-functional teams, protecting intellectual property, and interfacing with customers to accelerate speed-to-market while reducing costs. The successful candidate will manage pilot lines, oversee multiple product developments, and collaborate with design and production teams to
Qualifications
- Bachelor's Degree in Computer Science, Software Engineering, Electrical & Electronic Engineering, Physics, or a related technical discipline.
- Advanced technical or business qualifications would be an advantage.
- Significant experience in Research & Development, semiconductor packaging, product development, technology development, or semiconductor manufacturing.
- Strong experience leading new product development from concept through qualification and mass production.
- Demonstrated experience in IC packaging, assembly, testing, semiconductor materials, or related technologies.
- Experience managing technology roadmaps, R&D programs, and cross-functional technical teams.
- Experience engaging directly with customers on technical and product development matters.
- Experience managing R&D budgets, resources, technology investments, and commercialization activities.
- Experience in intellectual property, patents, or technology commercialization would be an advantage.
Responsibilities
- Lead strategic initiatives for developing and commercializing technologies and roadmaps.
- Drive leadership to establish internal capabilities and cost reduction.
- Provide direction on strategies for Carsem Technology Center Programs.
- Build infrastructure to achieve strategic development goals.
- Manage patent procedures for Carsem M-site and S-site.
- Interface with customers on new products, materials, and process development focusing on speed and cost.
- Develop and manage multiple products and design teams enabling fast time to market.
- Packaging solutions and presentations on technology.
- Work with design and production teams to assess information for design, assembly, testing.
- Develop technical aspects of the company’s strategy to align with goals.
- Advise management on new developments affecting profit, schedule, costs, customer relations.
- Maintain knowledge of new technologies to improve operations and present recommendations.
- Enhance and develop new products for key market segments and grow into new markets.
- Manage the pilot line to ensure efficient operation and drive continuous improvement.
Skills
Education
Tools
Job description
To lead the strategic initiatives for developing, commercializing the innovative technologies and corporate CTC roadmaps.
Drive leadership to establish critical internal capabilities, drive value-engineering for materials cost reduction and problem-solving issues.
To ensure that Carsem’s technology is competitive among the semiconductors’ best by incorporating: -
To provide direction and make recommendations on all strategies for Carsem Technology Center Programs.
To build the infrastructure to ensure all strategic developments goals are effectively carried out.
Manage patent procedures for both Carsem M-site and S-site (ensure intellectual properties are protected).
Interface with customers on new products/ materials and process development focusing on speed, cost-effectiveness & manufacturing from womb to tomb.
Develop and manage multiple Company products and design teams effectively enabling a fast time to market at optimum cost.
Packaging solutions and customer-facing “deep dive” presentations on technology.
Working closely with design and production teams to assess and provide required information for design, assembly, and testing rating of products.
Develop technical aspects of the company’s strategy to ensure alignment with its business goals.
Advising management of new developments that may affect profit, schedule, costs, customer relations, and/or inter-department relations.
Maintains a working knowledge of new technologies that may improve operations, products, and presenting those recommendations accordingly.
To enhance and develop new products for key market segments and to grow into new markets.
Management of the pilot line to ensure that it is operating is efficient while driving continuous improvement
Any other duties assigned by management.
Bachelor's Degree in Computer Science, Software Engineering, Electrical & Electronic Engineering, Physics, or a related technical discipline.
Advanced technical or business qualifications would be an advantage.
Significant experience in Research & Development, semiconductor packaging, product development, technology development, or semiconductor manufacturing.
Strong experience leading new product development from concept through qualification and mass production.
Demonstrated experience in IC packaging, assembly, testing, semiconductor materials, or related technologies.
Experience managing technology roadmaps, R&D programs, and cross-functional technical teams.
Experience engaging directly with customers on technical and product development matters.
Experience managing R&D budgets, resources, technology investments, and commercialization activities.
Experience in intellectual property, patents, or technology commercialization would be an advantage.
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFPSiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy
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