Semiconductor Packaging Design Engineer

Carsem (M) Sdn. Bhd

Ipoh

On-site

MYR 180,000 - 260,000

Full time

7 days ago

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Benefits offered by this job

Medical

Education support

Dental

Parking

Medical for immediate family members

car subsidy

Job summary

Carsem seeks a seasoned Leadframe & Substrate Design Engineer to lead design, simulation, and rules development for advanced semiconductor packaging in Ipoh, Malaysia. You will drive sub-micron precision packaging within the Power Discrete segment, bridging CAD, multiphysics simulations, DFM/DFT, and customer-facing support.

You will collaborate with cross-functional teams to deliver robust designs, perform tolerance analyses, and ensure compliance with international standards.

Qualifications

7+ years hands-on experience in Leadframe and Substrate Design in Power Discrete.
Experience with Power Module Design is a strong plus.
CAD and simulation proficiency in SolidWorks/AutoCAD/Creo and FEA tools like ANSYS/COMSOL.

Responsibilities

Lead 3D mechanical modeling and simulation of leadframes and substrates.
Develop GD&T for sub-micron precision packaging components.
Perform thermal-mechanical and electrical parasitic modeling for high-power packaging.
Conduct FEA to mitigate design risks (stress, warpage, thermal management).
Develop and update internal DFM/DFT rules, collaborating with cross-functional teams and customers.

Skills

Leadframe design

Substrate design

GD&T

FEA/multiphysics

Thermal modeling

Customer engagement

Multiphysics simulation

Tools

SolidWorks

AutoCAD

Creo

ANSYS

COMSOL

Job description

We are seeking a seasoned Leadframe & Substrate Design Engineer to lead the design, simulation, and rules development for advanced semiconductor packaging.

In this role, you will drive sub-micron precision packaging solutions in the power discrete segment (expanding beyond traditional QFNs into advanced power modules). You will bridge the gap between initial CAD modeling, multiphysics simulations, DFM rules, and customer-facing technical support.

Key Responsibilities

1. Design & Multiphysics Simulation

Lead 3D mechanical modeling, design, and simulation of leadframes and substrates using industry-standard CAD tools to support progressive stamping die creation.

Apply Geometric Dimensioning and Tolerancing (GD&T) to ensure sub-micron precision for critical power and thermal packaging components.

Perform Thermal Mechanical Analysis (TMA) and Electrical Parasitic Modeling/Simulations to evaluate high-power performance.

Conduct robust Finite Element Analysis (FEA) simulations to mitigate early-stage design risks (stress, warpage, thermal management).

2. Process & Design Rules Development

Establish and update internal design rules based on customer specifications and packaging assembly process capabilities.

Systematically incorporate Design for Manufacturability (DFM) and Design for Testing (DFT) principles into early design phases.

Apply knowledge of stamped and etched leadframe tooling specifications and manufacturing methodologies.

3. Analysis, Reliability & Standards

Perform worst-case tolerance stack-up analysis, DFMEA, and reliability risk assessments.

Ensure all designs meet strict cost, thermal, electrical performance, and international industry standards/regulations.

Stay ahead of emerging semiconductor packaging technologies, materials, and power discrete industry trends.

4. Cross-Functional Leadership & Customer Engagement

Collaborate closely with internal cross-functional teams, including Assembly Process Engineering, Mechanical Engineering, Quality Assurance, and Tooling vendors.

Lead technical design reviews and directly engage with key customers and external technical partners throughout project development.

Requirements

Experience: Minimum 7+ years of hands-on experience in Leadframe & Substrate Design, specifically within the Power Discrete segment (QFN, DFN, Clip-bond, etc.).

Specialized Experience: Exposure to Power Module Design is a strong added advantage.

CAD & Simulation Tools: Expertise in high-end CAD software (e.g., SolidWorks, AutoCAD, Creo) and FEA/multiphysics simulation suites (e.g., Ansys, COMSOL).

Technical Mastery: Deep proficiency in GD&T, DFM/DFT, thermal/electrical modeling, and tolerance analysis.

Fabrication Knowledge: Strong understanding of sheet metal fabrication, precision stamping, etching, welding, and riveting techniques.

Communication: Excellent technical communication skills with a proven track record in customer-facing technical reviews.

Consumer Electronics Manufacturing More than 10,000 employees

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.