Process Engineer: Diebond & Solder Dispense - Impact & Growth

Onsemi; Seremban; Vor Ort; MYR 42.000 - 66.000; Vollzeit

Zusammenfassung

onsemi in Malaysia is seeking a hands-on Process Engineer focused on Diebond or solder print or dispensing to drive process improvements and product development. The role requires technical leadership, training, and collaboration with internal and external customers in a fast-paced manufacturing setting.

The ideal candidate has a engineering degree with manufacturing experience and strong analytical, communication, and problem-solving skills.

Qualifikationen

• Bachelor’s degree in engineering with 1+ years industrial/manufacturing experience.
• Experience with JMP, Minitab, Tableau or similar software.
• Strong analytical and problem-solving skills; able to work in fast-paced environment.

Aufgaben

• Supports and assesses existing processes and workflows.
• Designs and implements basic engineering projects: process development, process design.
• Troubleshoot process development issues and interacts with mechanical, electrical and software engineers to resolve issues and fix bugs.
• Assembles reports to document process status and changes.
• Develops and implements process improvements and optimization projects.
• Provides development and troubleshooting support from growth through wafer processes.
• Assists in the creation and maintenance of complex documentation sets, involving highly technical material, for training purposes under limited supervision.
• Uses best practices and knowledge of internal or external business goals to develop new products or services.
• Tracks and reports on operational metrics for areas of improvement and monitoring performance of tests/upgrades.
• Development of new processes and equipment
• Provides thorough instructions for successful implementation of process improvements/changes.
• Assist in the design and execution of experiments and statistical data analysis.
• Project leadership
• Other tasks as needed or assigned
• Self-motivated and independent
• Integrity
• Action Oriented
• Strategic Agility & Planning
• Communication Skills (both written and presentation).
• Strong attention to detail
• Cross-functional
• Familiarity with health and safety requirements in an industrial environment

Kenntnisse

Analytical thinking

Organizational skills

Planning

Troubleshooting

Effective communication

Team collaboration

Ausbildung

Bachelor's degree in engineering

Advanced degree with relevant lab experience

Tools

JMP

Minitab

Tableau

MS Project

Excel

PowerPoint

Word

Jobbeschreibung

onsemi in Malaysia is seeking a hands-on Process Engineer focused on Diebond or solder print or dispensing to drive process improvements and product development. The role requires technical leadership, training, and collaboration with internal and external customers in a fast-paced manufacturing setting.

The ideal candidate has a engineering degree with manufacturing experience and strong analytical, communication, and problem-solving skills.