Process Development Engineer - mold + grinding/laser mark/ball attach/package saw

STMicroelectronics; Muar; Sur place; MYR 67 000 - 112 000; Plein temps

Résumé du poste

STMicroelectronics in Malaysia is seeking a highly capable Process Engineer to develop, set up, and industrialize PLP Ball Attach and Package Saw processes within our semiconductor assembly operations. The role requires deep expertise in process development and hands-on manufacturing support.

The successful candidate will characterize processes, prepare specifications, SOPs, FMEAs, and control plans, while driving improvements in quality, yield, and reliability across new products and materials.

Qualifications

• Bachelor’s, Master’s, or PhD in Engineering or related field.
• 3+ years of relevant experience in process development, semiconductor manufacturing, or assembly processes.
• Strong statistical data analysis skills.
• Experience with 8D, DMAIC, Process Mapping, Fishbone analysis, and 5 Whys.
• Ability to identify issues quickly, respond to process challenges, and implement effective solutions.
• Strong understanding of production environments and manufacturing operations.
• Demonstrated teamwork, ownership, and commitment to high-quality project execution.
• Ability to work effectively in a fast-paced and collaborative environment.

Responsabilités

• Develop, set up, and industrialize PLP Ball Attach and Package Saw processes.
• Support the introduction of new products, materials, and technologies into assembly manufacturing.
• Characterize PLP Ball Attach and Package Saw processes and related materials.
• Prepare, review, and update process specifications, SOPs, FMEAs, process control plans, and related documentation.
• Conduct process optimization to improve quality, yield, productivity, and reliability.
• Provide technical support for process-related issues, including quality concerns and troubleshooting.
• Collaborate with cross-functional teams, including Engineering, Production, Quality, and Operations, to ensure smooth project execution.
• Drive continuous improvement activities and support manufacturing readiness for new applications.

Connaissances

Statistical analysis

8D

DMAIC

Process mapping

Fishbone analysis

5 Whys

Problem solving

Teamwork

Formation

Engineering degree (Bachelor/Master/PhD)

Description du poste

OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

YOUR ROLE

• Develop, set up, and industrialize PLP Ball Attach and Package Saw processes.
• Support the introduction of new products, materials, and technologies into assembly manufacturing.
• Characterize PLP Ball Attach and Package Saw processes and related materials.
• Prepare, review, and update process specifications, SOPs, FMEAs, process control plans, and related documentation.
• Conduct process optimization to improve quality, yield, productivity, and reliability.
• Provide technical support for process-related issues, including quality concerns and troubleshooting.
• Collaborate with cross-functional teams, including Engineering, Production, Quality, and Operations, to ensure smooth project execution.
• Drive continuous improvement activities and support manufacturing readiness for new applications.

Your Skills & Experiences

• Bachelor’s, Master’s, or PhD degree in Engineering or a related field, such as Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Semiconductor Technology, or Material Science.
• More than 3 years of relevant experience in process development, semiconductor manufacturing, or assembly processes.
• Strong statistical data analysis skills, with the ability to interpret process and quality data effectively.
• Solid analytical and problem-solving skills, with experience in structured methodologies such as 8D, DMAIC, Process Mapping, Fishbone analysis, and 5 Whys.
• Ability to identify issues quickly, respond to process challenges, and implement effective solutions.
• Strong understanding of production environments and manufacturing operations.
• Demonstrated teamwork, ownership, and commitment to high-quality project execution.
• Ability to work effectively in a fast-paced and collaborative environment.

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

To discover more, visit st.com/careers.