Precision Pick & Place Engineer for Die Prep

Intel; Kulim; On-site; MYR 80,000 - 120,000; Full time

Job summary

Intel is seeking a Process and Equipment Engineer specialized in Pick and Place (PnP) to drive high-precision assembly performance in our Die Preparation factory. You will own process parameters, lead troubleshooting, and work with vendors to upgrade hardware and software, impacting yield, uptime, and OEE.

The role emphasizes data-driven problem solving, SPC/DOE/FMEA/RCA techniques, and collaboration with R&D to ramp new products in a global packaging group. On-site in Malaysia, Kulim.

Qualifications

• Bachelor/Master degree in Electrical/Electronics/Mechanical/Mechatronics or Materials Engineering.
• Fresh graduates are welcome to apply.
• Experience in semiconductor back-end assembly and PnP processes is a plus.
• Knowledge of SPC/DOE/FMEA/RCA and structured problem solving.
• Good communication and cross-functional collaboration.

Responsibilities

• Process Optimization - Own, stabilize, and optimize pick and place, PnP process parameters, drive systematic yield improvement, and resolve process integration issues.
• Equipment Engineering - Lead complex troubleshooting, preventive/corrective maintenance strategies, and collaborate with tool vendors to upgrade hardware/software.
• Data and Yield Analysis - Utilize SPC, DOE, FMEA, and RCA to identify root causes of process drift or hardware failures.
• Cross-Functional Collaboration - Partner with upstream/downstream process owners and R&D teams to transfer and ramp new products.
• Documentation and Standards - Standardize SOPs, document troubleshooting guides, and present technical findings to factory stakeholders.

Education

Bachelor/Master Degree in Electrical / Electronics / Mechanical/ Mechatronics and Materials Engineering

Tools

SPC

DOE

FMEA

RCA

Job description

Intel is seeking a Process and Equipment Engineer specialized in Pick and Place (PnP) to drive high-precision assembly performance in our Die Preparation factory. You will own process parameters, lead troubleshooting, and work with vendors to upgrade hardware and software, impacting yield, uptime, and OEE.

The role emphasizes data-driven problem solving, SPC/DOE/FMEA/RCA techniques, and collaboration with R&D to ramp new products in a global packaging group. On-site in Malaysia, Kulim.