Die Prep Module Engineer (Contract Role)

Intel; Kulim; On-site; MYR 80,000 - 120,000; Full time

Job summary

Intel is seeking a Process and Equipment Engineer specialized in Pick and Place (PnP) to drive high-precision assembly performance in our Die Preparation factory. You will own process parameters, lead troubleshooting, and work with vendors to upgrade hardware and software, impacting yield, uptime, and OEE.

The role emphasizes data-driven problem solving, SPC/DOE/FMEA/RCA techniques, and collaboration with R&D to ramp new products in a global packaging group. On-site in Malaysia, Kulim.

Qualifications

• Bachelor/Master degree in Electrical/Electronics/Mechanical/Mechatronics or Materials Engineering.
• Fresh graduates are welcome to apply.
• Experience in semiconductor back-end assembly and PnP processes is a plus.
• Knowledge of SPC/DOE/FMEA/RCA and structured problem solving.
• Good communication and cross-functional collaboration.

Responsibilities

• Process Optimization - Own, stabilize, and optimize pick and place, PnP process parameters, drive systematic yield improvement, and resolve process integration issues.
• Equipment Engineering - Lead complex troubleshooting, preventive/corrective maintenance strategies, and collaborate with tool vendors to upgrade hardware/software.
• Data and Yield Analysis - Utilize SPC, DOE, FMEA, and RCA to identify root causes of process drift or hardware failures.
• Cross-Functional Collaboration - Partner with upstream/downstream process owners and R&D teams to transfer and ramp new products.
• Documentation and Standards - Standardize SOPs, document troubleshooting guides, and present technical findings to factory stakeholders.

Education

Bachelor/Master Degree in Electrical / Electronics / Mechanical/ Mechatronics and Materials Engineering

Tools

SPC

DOE

FMEA

RCA

Job description

Job Details:

Job Description:

The Role and Impact
As a Process and Equipment Engineer specializing in Pick and Place, PnP technology, you will be the technical owner driving the performance, capability, and stability of high-precision assembly equipment within our advanced Die Preparation factory. In this role, you will leverage your deep technical expertise to address complex electro-mechanical challenges, optimize high-speed pick and place processes, and implement innovative solutions in a dynamic, high-volume manufacturing environment.

Your hands-on contributions will directly impact factory yield, equipment uptime, OEE, and process stability, playing a vital role in enabling Intel's packaging roadmap and supporting the delivery of next-generation, cutting-edge silicon technologies.

Business group
As part of Intel Wafer Packaging Manufacturing group, you will join a globally recognized organization at the forefront of semiconductor packaging. We design, develop, and deliver innovative factory solutions to meet evolving technology needs. With a commitment to driving advancements in high-density modular assembly, computing, and connectivity, our group fosters a highly collaborative and innovation-driven environment to enable Intel's success in its core business areas.

Key Responsibilities

• Process Optimization - Own, stabilize, and optimize pick and place, PnP process parameters, drive systematic yield improvement, and resolve process integration issues.
• Equipment Engineering - Lead complex troubleshooting, preventive/corrective maintenance strategies, and collaborate with tool vendors to upgrade hardware/software.
• Data and Yield Analysis - Utilize Statistical Process Control, SPC, Design of Experiments, DOE, and Failure Mode and Effects Analysis, FMEA to identify root causes of process drift or hardware failures.
• Cross-Functional Collaboration - Partner with upstream/downstream process owners and research and development teams to seamlessly transfer and ramp new products, NPI.
• Documentation and Standards - Standardize operating procedures - SOPs, document troubleshooting guides, and present technical findings/progress updates directly to factory stakeholders.

Qualifications:

• Bachelor/Master Degree in Electrical / Electronics / Mechanical/ Mechatronics and Materials Engineering with minimum 2 years of work experience.
• Fresh graduate is welcome to apply.
• Good knowledge experience in semiconductor back-end assembly, specifically within Die Preparation and pick and place, PnP processes will be an added advantage.
• Basic understanding of Statistical Process Control, SPC, statistical data analysis, and structured problem-solving methodologies. Expertise in Design of Experiments, DOE, Failure Mode and Effects Analysis, FMEA, and Root Cause Analysis, RCA will be an added advantage.
• Good communication skills with the ability to collaborate in cross-functional team environments and present technical data clearly.

Job Type: Intel Contract Employee

Shift: Shift 1 (Malaysia)

Primary Location: Malaysia, Kulim

Additional Locations:

Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation or ordinance.

Position of Trust N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.