Staff Process Engineer

SmartRecruiters, Inc.; Hang Tuah Jaya; On-site; MYR 60,000 - 100,000; Full time

Job summary

Renesas Electronics is seeking a manufacturing engineer to qualify PQFN packages for SPS products. You will design processes, ramp up volume, and sustain line performance while collaborating with Test, Product, Quality and Operations to meet internal and industry standards.

You will manage lifecycle documents, drive changes with suppliers, and coordinate with OSAT and contract manufacturers to support production, with a focus on yield, capacity, quality, and cost improvements.

Qualifications

• Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
• Experience in process engineering or package development of thin wafer handling and SPS solder attach processes.
• Knowledge of PQFN/QFN/WLCSP and leaded package quality/reliability.
• Knowledge of wire bonding.
• Knowledge of SPC and JMP.
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and presentation skills. Able to manage large projects effectively.

Responsibilities

• Design package, develop processes to qualify PQFN packages for SPS products and modules.
• Ramp up manufacturing volume and qualify required sources.
• Sustain line performance; improve yield, capacity, quality and costs.
• Address feedback/issues with Test, Product, Quality & Operations.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain/improve capacity and cost.
• Partner with Quality and Reliability teams to meet standards.
• Serve as the manufacturing interface for NPI-to-production transfers.
• Manage OSAT and contract manufacturing relationships supporting production.

Skills

Wire bonding

SPC / JMP

English communication

Analytical thinking

Education

Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences

Tools

JMP

Job description

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

Key Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost.
• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Serve as the key manufacturing engineering interface for NPI-to-production transfers.
• Manage OSAT and contract manufacturing relationships supporting production.

Qualifications

• Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
• Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
• Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
• Knowledge of wire bonding.
• Knowledge of SPC and statistical analysis software (such as JMP).
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and presentation skills. Able to manage large projects effectively.

Nice to haves:

• Cu Clip, Thin Die, Power QFN
• Experience transitioning products from Development to Production
• Experience supporting NPI to Mass Production

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .