Packaging Engineer – Semiconductors | CAP Career Path

Texas Instruments; Kuala Lumpur; On-site; MYR 40,000 - 60,000; Full time

Job summary

Texas Instruments is seeking a Packaging Engineer in Kuala Lumpur, Malaysia. This role offers participation in the Career Accelerator Program, providing professional training to develop packaging technologies for semiconductor solutions.

You will collaborate with cross-functional teams, engage in product qualification, and conduct various engineering models to enhance packaging reliability. We seek candidates with a relevant engineering degree and strong analytical skills.

Qualifications

• Cumulative ≥ 3.3 CGPA and above.
• Open to fresh graduates and up to 2 years of relevant experience.

Responsibilities

• Partner with businesses to design and develop solutions for semiconductor packaging technologies.
• Participate in cross-functional teams for product qualification and production.
• Conduct electrical, mechanical, thermal models to understand silicon-to-package interaction.

Skills

Analytical skills

Problem solving skills

Strong written and verbal communication skills

Time management

Team collaboration

Education

Bachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering, or Mechatronics Engineering

Job description

Texas Instruments is seeking a Packaging Engineer in Kuala Lumpur, Malaysia. This role offers participation in the Career Accelerator Program, providing professional training to develop packaging technologies for semiconductor solutions.

You will collaborate with cross-functional teams, engage in product qualification, and conduct various engineering models to enhance packaging reliability. We seek candidates with a relevant engineering degree and strong analytical skills.