Junior Semiconductor Package Saw Equipment Engineer

118-WW TMG MFG OPS; Malaysia; On-site; MYR 60,000 - 90,000; Full time

Job summary

Texas Instruments Malaysia is launching a 12-month Career Accelerator Program (CAP) for new engineering graduates within the TMG Development program. As an Equipment Engineer, you will work in a dynamic, team-oriented environment and gain hands-on experience maintaining package sawing equipment and driving improvements.

You will participate in on-the-job learning, problem solving, and cross-functional collaboration to support production goals and safety standards.

Qualifications

• Bachelor’s degree in engineering (Mechanical, Electrical, Mechatronics, Electronics) or related field.
• Fresh graduate or ≤2 years hands-on experience in semiconductor backend manufacturing, preferably package sawing/dicing.

Responsibilities

• Lead and sustain package sawing equipment to achieve high machine OEU, productivity, and process stability.
• Perform preventive, corrective, and predictive maintenance to ensure equipment reliability.
• Troubleshoot equipment, process, and product-related issues using structured problem-solving methodologies (e.g., 8D, 5 Why, Fishbone).
• Optimize machine parameters to improve yield, throughput, and overall equipment effectiveness (OEU).
• Drive continuous improvement initiatives to reduce downtime, maintenance cost, and process variation.
• Team player and collaborate with Process, Manufacturing, Quality, and Production teams to resolve technical issues and support production goals.
• Lead equipment qualification, installation, acceptance, and process buy-off for new tools and technology transfers.
• Analyze equipment performance data and establish action plans to improve MTBA, and equipment availability.
• Develop and maintain maintenance procedures, work instructions, FMEA, PM checklists, and technical documentation.
• Support engineering projects, cost reduction initiatives, automation improvements, and compliance with safety and quality standards.

Skills

Team collaboration

Problem solving

Communication skills

Initiative

Education

Bachelor’s Degree in Mechanical/Electrical/Mechatronics/Electronics Engineering

Tools

AMAT PVD

AMAT TxZ chambers

PVD/CVD vacuum systems

Other semiconductor tools

Job description

Texas Instruments Malaysia is launching a 12-month Career Accelerator Program (CAP) for new engineering graduates within the TMG Development program. As an Equipment Engineer, you will work in a dynamic, team-oriented environment and gain hands-on experience maintaining package sawing equipment and driving improvements.

You will participate in on-the-job learning, problem solving, and cross-functional collaboration to support production goals and safety standards.