Package Architect

altera; Seberang Perai; On-site; MYR 180,000 - 260,000; Full time

Job summary

Altera in Penang, Malaysia seeks a senior packaging professional to translate product requirements into package architecture and drive end-to-end solutions for electrical, thermal, and reliability standards. You will lead substrate and package design projects and collaborate across silicon, hardware, and manufacturing teams to ensure seamless production transitions.

The role requires 15+ years of experience with a BS/MS in EE/ME/CE/CS or related fields, and experience with packaging tools such

Qualifications

• 15+ years of experience in packaging or board design and related tools.
• Lead substrate and package design and development projects.

Responsibilities

• Translate product requirements into package architecture and drive end-to-end packaging solutions.
• Collaborate with silicon, hardware, and package leads to ensure high quality packaging output.
• Oversee end-to-end package development process and improve packaging quality standards.
• Resolve packaging problems and provide cost-effective solutions.
• Collaborate with manufacturing to transition design to production.

Skills

Packaging design experience

Board design experience

Leadership

Education

BS/MS in EE/ME/CE/CS

Tools

Mentor Graphics

Cadence

AutoCAD

Job description

Job Details:

Job Description:

Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements. Leads technology trade-off decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones.

Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks.

Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets.

Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions.

Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.

Qualifications:

What We Want to See

We are seeking someone with 15+ years of experience and a BS/MS in EE, ME, CE, CS or related fields with experience in one or more of the following:

• Packaging or Board design development and equivalent package design tools
• Lead substrate and package design and development projects

Ways to Stand Out from the Crowd

• Experience in developing & automated design flows and tracking design efficiency metrics
• Experience in Semiconductor Packaging Substrate technology design and development
• Experience in Package design tools such as Mentor Graphics, Cadence and/or Auto CAD

Job Type:

Regular

Shift:

Shift 1 (Malaysia)

Primary Location:

Penang 15, Penang, Malaysia

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.