Senior Packaging Engineer

Power Integrations; Malaysia; On-site; MYR 70,000 - 90,000; Full time

Job summary

A leading semiconductor company in Malaysia is looking for a hands-on Resident Package Engineer to support mass production of multi-die wirebond leadframe packages. This role involves sustaining manufacturing performance and managing technical processes at the OSAT partner. Ideal candidates should have a B.S. in a relevant engineering field and at least 2 years of experience in semiconductor back-end assembly. Strong wirebond process knowledge and excellent troubleshooting skills are essential for success in this position.

Qualifications

• Minimum 2 years’ experience in semiconductor back-end assembly — volume production experience required.
• Strong practical knowledge of leadframe design considerations and plating.
• Willingness to be based full-time at the OSAT site with occasional travel required.

Responsibilities

• Act as the on-site technical owner at the OSAT for all packaging activity.
• Support and troubleshoot day-to-day production issues.
• Implement and maintain RTM artifacts including process flows and control plans.
• Drive process control and SPC; define control charts and capability studies.
• Oversee supplier change control and participate in supplier audits.

Skills

Wirebond processes

Problem solving using 8-D methods

Communication skills

FMEA

SPC

Education

B.S. in Electrical, Mechanical, Materials, or Chemical Engineering

Tools

QC/FA tools (cross-section, decap, SEM, X-ray)

Job description

Job Description

We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier process control, and robust release-to-manufacturing (RTM) protocols to ensure product quality, yield and on-time delivery.

Key responsibilities

• Act as the on-site technical owner at the OSAT for all packaging activity; act as primary engineering interface between OSAT operations and our packaging / product teams.
• Support and troubleshoot day-to-day production issues (quality holds, yield excursions) and lead root-cause analysis and permanent corrective actions (8-D, RCA).
• Implement and maintain RTM artifacts including process flows, control plans, work instructions, and SOPs.
• Drive process control and SPC: define control charts, sample plans, capability studies (Cp/Cpk) and guardbanding for critical steps (die attach, wirebond, mold, trim/form, plating).
• Oversee supplier change control and PCNs (Process Change Notices), BOM/process releases and supplier qualification runs.
• Participate in supplier audits and periodic process/quality audits at the OSAT; capture and escalate nonconformances.
• Run process characterization and DOE to improve yield, quality, capacity, and cycle time; document outcomes and update process specs.
• Coordinate failure analysis and disposition of discrepant material (with material review board support).
• Work with NPI and sustaining teams to transfer new or revised processes into consistent mass production practices.
• Report KPIs weekly (yield, DPPM, escape rate, cycle time, open corrective actions).

Required qualifications

• B.S. in Electrical, Mechanical, Materials, Chemical engineering or related discipline.
• Minimum 2 years’ experience in semiconductor back-end assembly — volume production experience required.
• Strong practical knowledge of wirebond processes, leadframe design considerations, clip bonding, plating and molding/encapsulation.
• Strong problem solving using 8-D, FMEA, DOE, SPC
• Experience with QC/FA tools (cross-section, decap, SEM, X-ray) and reading FA reports.
• Excellent communication skills — able to write process specs
• Willingness to be based full-time at the OSAT site with occasional travel to Malaysian operations hub in Penang.

Additional preferred qualifications

• Direct experience producing power packages or automotive qualification work.
• Knowledge of AEQ Automotive reliability requirements
• Knowledge of APQP automotive development process
• Knowledge of JEDEC/IPC standards
• Ability to work in a fast-paced environment
• Able to occasionally work with colleagues in the US timezone