Package Architect

Altera

George Town

On-site

MYR 180,000 - 300,000

Full time

14 days+

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Job summary

Altera in Penang, Malaysia is seeking an experienced packaging architect to translate product requirements into robust package designs and oversee end-to-end development. You will drive trade-off decisions to meet electrical, mechanical, thermal, and reliability standards, leading collaboration with silicon, hardware, and packaging teams to deliver high-quality outputs and seamless tape-out to production.

The ideal candidate has 15+ years in packaging, a BS/MS in EE/ME/CE/CS, and hands-on

Qualifications

  • 15+ years of experience in packaging design.
  • BS/MS in EE, ME, CE, CS or related fields.
  • Experience with packaging design tools.
  • Experience in Semiconductor Packaging Substrate technology.
  • Experience with Mentor Graphics, Cadence and/or AutoCAD.

Responsibilities

  • Translate product requirements into package architecture specification.
  • Drive end-to-end packaging solutions for electrical, mechanical, thermal, and cost requirements.
  • Lead trade-off decisions ensuring packaging conforms to standards and landing zones.
  • Collaborate with silicon, hardware, and package leads to ensure high quality output and remove roadblocks.
  • Oversee packaging development processes and improve packaging quality standards.
  • Troubleshoot packaging problems and provide innovative, cost-effective solutions.
  • Coordinate with manufacturing to ensure tape-out transitions to production.

Skills

Packaging design
Package design tools
Design flows automation
Semiconductor packaging substrate
Mentor Graphics Cadence AutoCAD

Education

Bachelor/Master in EE/ME/CE/CS

Tools

Mentor Graphics
Cadence
AutoCAD

Job description

Job Details: Job Description: Translates product requirements into package architecture specification, drives end-to-end package solutions for physical, electrical, and cost requirements. Leads technology trade-off decisions ensuring silicon packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones. Collaborates with silicon, hardware, and package leads to ensure high quality package output and aids in removing roadblocks. Oversees end-to-end package development process, including design, processes, and procedures and continuously improves packaging quality standards and targets. Applies expertise in package design troubleshooting, resolves new and existing packaging problems involving designs, materials, and processes and provides innovative and cost-effective solutions. Collaborates with manufacturing team to ensure the packaging design and tape-out seamlessly transition to production.

Qualifications

What We Want to See We are seeking someone with 15+ years of experience and a BS/MS in EE, ME, CE, CS or related fields with experience in one or more of the following:

  • Packaging or Board design development and equivalent package design tools
  • Lead substrate and package design and development projects
  • Ways to Stand Out from the Crowd
  • Experience in developing & automated design flows and tracking design efficiency metrics
  • Experience in Semiconductor Packaging Substrate technology design and development
  • Experience in Package design tools such as Mentor Graphics, Cadence and/or Auto CAD
Job Type

Regular Shift: Shift 1 (Malaysia)

Primary Location: Penang 15, Penang, Malaysia

Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

About Altera

Altera: Accelerating Innovators Altera provides leadership programmable solutions that are easy-to-use and deploy in applications from cloud to edge, offering limitless AI possibilities. Our end-to-end broad portfolio of products including FPGAs, CPLDs, Intellectual Property, development tools, System on Modules, SmartNICs and IPUs provide the flexibility to accelerate innovation. Altera is helping to shape the future through pioneering innovation that unlocks extraordinary possibilities for everyone on the planet.

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