Senior Semiconductor Package Architect & Design Lead

Altera Corporation; Malaysia; On-site; MYR 180,000 - 300,000; Full time

Job summary

Altera Corporation in Penang, Malaysia seeks a senior packaging engineer to translate product requirements into package architecture and drive end-to-end packaging solutions. The role ensures alignment with electrical, mechanical, thermal, and reliability standards while collaborating with silicon, hardware, and package leads.

Ideal candidates have 15+ years in packaging or board design, with hands-on experience in Mentor Graphics, Cadence, or AutoCAD and a track record of cost-effective,

Qualifications

• 15+ years of related experience.
• BS/MS in EE/ME/CE/CS or related fields.
• Experience with packaging or board design development.
• Experience with automated design flows and tracking design efficiency metrics.

Responsibilities

• Translate product requirements into package architecture specifications.
• Lead end-to-end package development, including design, processes and procedures.
• Collaborate with manufacturing to ensure tape-out transitions to production.

Skills

Package design

Design automation

Design metrics tracking

Education

BS/MS in EE/ME/CE/CS or related fields

Tools

Mentor Graphics

Cadence

AutoCAD

Job description

Altera Corporation in Penang, Malaysia seeks a senior packaging engineer to translate product requirements into package architecture and drive end-to-end packaging solutions. The role ensures alignment with electrical, mechanical, thermal, and reliability standards while collaborating with silicon, hardware, and package leads.

Ideal candidates have 15+ years in packaging or board design, with hands-on experience in Mentor Graphics, Cadence, or AutoCAD and a track record of cost-effective,