Lead Process Engineer – LED Assembly & NPI

Lumileds Malaysia Sdn Bhd

Bayan Lepas

On-site

MYR 90,000 - 130,000

Full time

10 days ago

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Job summary

Lumileds Malaysia Sdn Bhd is seeking a Process Engineer (Stud Bumping/Tape&Reel/Wire Bond/Die Attach) to lead NPI and high-volume production in TFFC process engineering. You will own process performance, quality, yield, and cost metrics while driving continuous improvement across fabrication steps.

Key responsibilities include DoE studies, process development, training operations, and transfer/qualification of new processes.

Qualifications

Bachelor's degree in Engineering/Science required.
Skilled in statistical analysis, 8D, SPC, FMEA, DMAIC.
Problem solving oriented with strong analytical and interpersonal skills.

Responsibilities

Own and sustain stable Assembly process performance.
Own quality, yield, process capability and stability metrics.
Perform DoE and process window studies to optimize cost and quality.
Develop and optimize processes to improve quality and reliability.
Provide training and support to operations team.
Define equipment/material specs for Dia Attach/Stud Bump; set acceptance criteria.
Lead process transfer, qualification and ramp-up projects.
Drive CIP for cost reduction, capacity, yield, and performance.
Create and maintain procedure documentation for safety and quality standards.
Perform PFMEA and control plans; ensure compliance.