Lead/ Process Engineer (Stud Bumping/Tape&Reel/Wire Bond/Die Attach)

Lumileds Malaysia Sdn Bhd; Bayan Lepas; On-site; MYR 90,000 - 130,000; Full time

Job summary

Lumileds Malaysia Sdn Bhd is seeking a Process Engineer (Stud Bumping/Tape&Reel/Wire Bond/Die Attach) to lead NPI and high-volume production in TFFC process engineering. You will own process performance, quality, yield, and cost metrics while driving continuous improvement across fabrication steps.

Key responsibilities include DoE studies, process development, training operations, and transfer/qualification of new processes.

Qualifications

• Bachelor's degree in Engineering/Science required.
• Skilled in statistical analysis, 8D, SPC, FMEA, DMAIC.
• Problem solving oriented with strong analytical and interpersonal skills.

Responsibilities

• Own and sustain stable Assembly process performance.
• Own quality, yield, process capability and stability metrics.
• Perform DoE and process window studies to optimize cost and quality.
• Develop and optimize processes to improve quality and reliability.
• Provide training and support to operations team.
• Define equipment/material specs for Dia Attach/Stud Bump; set acceptance criteria.
• Lead process transfer, qualification and ramp-up projects.
• Drive CIP for cost reduction, capacity, yield, and performance.
• Create and maintain procedure documentation for safety and quality standards.
• Perform PFMEA and control plans; ensure compliance.

Skills

Statistical analysis tools

8D problem solving

SPC

FMEA

DMAIC

Interpersonal skills

Analytical mind

Microsoft Word

Excel

Project

PowerPoint

Initiative

Fast-paced environment

Education

Bachelor's degree in Engineering/Science

Tools

Die Attach

Wire Bond

Tape & Reel

Job description

Who We Are:

Lumileds International is a global leader in LED technology, innovation, and solutions for the automotive, display, illumination, mobile, and other markets where light sources are essential. Our approximately 3,300 employees operate in over 15 countries to partner with our customers to deliver solutions for lighting, safety, and well-being.

The Lumileds environment is fast-paced, cutting-edge, intelligent and fun! We are looking for exceptional talent to join our team! To learn more, visit lumileds.com.

Who You Are:

Position Summary:

Process Engineer (Stud Bumping/Tape&Reel/Wire Bond/Die Attach) responsible for all NPI (New Product Introduction) and Operation (High Volume Production) in TFFC process engineering

What You Will Do:

• Responsible for sustaining stable Assembly process performance.
• Full process ownership on quality, yield, process capability and stability, cost, CpK and other related KPI.
• Perform process window study using standard tools like DoE approach and material / equipment assessment to optimize process in term of cost, and quality.
• Responsible for process development / optimization to improve process quality and reliability.
• Establish optimum process and provide support to train operations team.
• Develop equipment / material specification for Dia Attach/Stud Bump process, including reject and acceptance criteria.
• Lead process transfer, process & tool qualification and ramp up related projects.
• Lead and drive Continuous Improvement Projects (CIP) to enable cost reduction, capacity expansion, yield and performance enhancement to enable the production of Best-In-Class LED chips at competitive cost.
• Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to safety & quality standard to meet legal & customer requirements.
• Perform risk assessment and derive necessary control to keep process stable. Owner of PFMEA, control plan and working instruction.
• Complies with environment, security, health and safety requirements.

What You Will Bring (Required Qualifications):

• Bachelor's degree of Engineering / Science.
• Skilled in Statistical analysis tools, 8D problem solving, SPC, FMEA, DMAIC
• Problem solving oriented and Strong analytical mind and interpersonal skills.
• Proficiency with Microsoft Word, Excel, Project and Power Point
• Initiative and able to work under minimum supervision.
• Comfortable working in a fast-paced environment.
• Detail orientated with matured interpersonal and communication skills.

Field of Study

Engineering or any other relevant technical field

Years of Experience (Minimum)

3-5 years

Preferred Qualifications:

• Minimum 3 years working experience in Die Attach & Wire Bond assembly process.
• Skilled in Statistical analysis tools, 8D problem solving, SPC, FMEA, DMAIC
• Problem solving oriented and Strong analytical mind and interpersonal skills.

Lumileds is an Equal Employment Opportunity Employer