Senior Staff Engineer: Package Tech & Risk Integration

Infineon Technologies; Malacca City; On-site; MYR 90,000 - 130,000; Full time

Job summary

Infineon Technologies seeks a seasoned engineer to lead DFMEA processes and risk analyses within the package technology domain. You will collaborate across FE/BE interfaces, integrate BOM/process data, and guide pre-development for next-gen chip tech.

The role rewards strong communication and problem-solving skills, with emphasis on reliability and cross-functional teamwork in a semiconductor environment.

Qualifications

• Bachelor’s Degree in Engineering with extensive IC/semiconductor experience in SMT, packaging, assembly and test.
• Strong communication, collaboration and problem-solving abilities.
• Knowledge of FE/BE interaction and BE/BE interfaces.
• Familiar with DFMEA/PFMEA and 8D/T6s methodologies.
• Experience with internal package analysis and first-level reliability.

Responsibilities

• PBC and TPC assessment.
• Driver of Package Technology DFMEA Process of Record.
• Owner of Risk Interaction assessment and mitigation work packages.
• Integration of unit processes (BOM and Process) in package platform -Risk assessment, study interaction with other processes, process flow.
• Working partner for FE in FE/BE interaction and integration topics.
• Support Pre development for new Chip technology.

Skills

Engineering degree

Semiconductor experience

SMT knowledge

Packaging

Assembly and Test

Communication skills

DFMEA/PFMEA

8D/T6s

FE/BE interaction

Package analysis

Reliability basics

Education

Bachelor’s Degree in Engineering

Job description

Infineon Technologies seeks a seasoned engineer to lead DFMEA processes and risk analyses within the package technology domain. You will collaborate across FE/BE interfaces, integrate BOM/process data, and guide pre-development for next-gen chip tech.

The role rewards strong communication and problem-solving skills, with emphasis on reliability and cross-functional teamwork in a semiconductor environment.