Lead Principal Engineer

Infineon Technologies AG; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

Infineon Technologies AG in Malaysia seeks an experienced engineer to drive Technology Integration activities to ensure the package fulfills all requirements in the area of Process Interaction. You will be a key working partner for FE colleagues on new FE technology.

Your role includes leading DFMEA Process of Record, owning Risk Interaction assessments, and integrating unit processes in the package platform with attention to risk, inter-process interactions, and process flow.

Qualifications

• Bachelor's degree in engineering with 10 years' IC/semiconductor experience.
• Experience across SMT, semiconductor packaging, assembly and test.
• Strong communication, collaboration, negotiation and problem solving.
• Knowledge of FE/BE and BE/BE interaction.
• Familiarity with 8D and T6s methodologies.
• Knowledge of DFMEA/PFMEA.
• Knowledge of internal package analysis and first level reliability.

Responsibilities

• PBC and TPC assessment and integration tasks.
• Drive DFMEA Process of Record for the package.
• Own Risk Interaction assessment and mitigation work packages.
• Integrate unit processes (BOM/Process) in the package platform; study inter-process interactions.
• Collaborate with FE in FE/BE interaction and integration topics.
• Support pre-development for new chip technology.

Skills

Communication

Collaboration

Negotiation

Solution finding

FE/BE interaction

BE/BE interaction

8D & T6s

DFMEA/PFMEA

Package reliability analysis

Education

Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)

Job description

Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key working partner for FE colleagues for new FE technology.

Your role

Key responsibilities in your new role

• PBC and TPC assessment.
• Driver of Package Technology DFMEA Process of Record.
• Owner of Risk Interaction assessment and mitigation work packages.
• Integration of unit processes (BOM and Process) in package platform -Risk assessment, study interaction with other processes, process flow.
• Working partner for FE in FE/BE interaction and integration topics.
• Support Pre development for new Chip technology.

Your profile

Qualifications and skills to help you succeed

• Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 10 years of working experience in IC/semiconductor environment SMT, Semiconductor Packaging, Assembly and Test knowledge.
• Good aptitude for communication, collaboration, negotiation and solution finding.
• Knowledge of FE/BE and BE/BE Interaction.
• Knowledge of 8D & T6s methodology.
• Knowledge of DFMEA/PFMEA.
• Knowledge of Internal Package analysis/ first level reliability.

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