FOL Process Engineering Lead / Manager – Pre-Assembly, Die Attach & Wire Bond

STMicro; Muar; On-site; MYR 180,000 - 240,000; Full time

Job summary

STMicroelectronics Malaysia is seeking a Lead FOL Process Engineer to guide Front-Of-Line assembly processes with expertise in Pre-Assembly, Die Attach, and Wire Bond. You will drive process improvements, ensure quality and yield, and maintain SPC-compliant operations in a high-volume environment.

You will coach engineers, maintain process specifications and control plans, and support NPI transitions. The role requires a Master’s or Bachelor’s in engineering, 7+ years in semiconductor process

Qualifications

• Bachelor's or Master's degree in engineering field with strong academic record.
• Proven leadership experience in a team setting.
• Experience in semiconductor manufacturing or related field preferred.
• Knowledge of quality tools such as DOE, FMEA, SPC, DMAIC, 8D.
• Strong communication and problem-solving abilities.

Responsibilities

• Lead the FOL team in driving process improvement initiatives and operational excellence.
• Sustain and improve process performance in quality, yield, and customer concern metrics.
• Support production to achieve targets and improve machine performance and reliability.
• Coach and develop engineers in daily activities and improvement projects.
• Prepare, review, and maintain process specs, SOPs, FMEAs, and control plans.
• Provide technical support for material and process-related quality issues.
• Ensure process compliance and stability within SPC control limits.
• Facilitate knowledge transfer from NPI to production for new products.

Skills

Communication

Analytical

Problem-solving

Leadership

Teamwork

Education

Master's degree in Mechanical Engineering

Bachelor's degree in Electrical Engineering

Bachelor's degree in Electronics Engineering

Job description

OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

The FOL Lead Process Engineer is responsible for leading the development, optimization, and sustaining of Front-Of-Line assembly processes, with strong expertise in Pre-Assembly, Die Attach, and Wire Bond. The role is accountable for ensuring process stability, product quality, yield enhancement, equipment performance, and continuous manufacturing excellence in a high-volume semiconductor assembly environment.

YOUR ROLE

• Lead the FOL team in driving process improvement initiatives and operational excellence.


• Sustain and improve process performance in terms of quality, yield, internal and external customer complaints, and lot hold rate.


• Support production to achieve WWS targets and improve machine performance and reliability.


• Coach and develop new engineers in their daily activities and improvement projects.


• Prepare, review, and maintain process specifications, SOPs, FMEAs, and process control plans.


• Provide technical support for critical quality issues related to materials and processes.


• Ensure process compliance and stability within SPC control limits.


• Facilitate knowledge transfer from NPI to production for new products and technologies introduced by the NPI team.

YOUR SKILLS & EXPERIENCES

• Master’s or Bachelor’s degree in Mechanical Engineering, Material Science, Electrical Engineering, Electronics Engineering, or a related engineering discipline.


• More than 7 years of experience in process control or a related semiconductor manufacturing field.


• Proven experience in team leadership is required.


• Strong communication, analytical, and problem-solving skills.


• Good knowledge of Design of Experiments (DOE), FMEA, SPC, DMAIC, 8D, and structured troubleshooting methodologies.


• Ability to anticipate issues, address challenges efficiently, and support production operations effectively.


• Strong execution capability and the ability to work in a fast-paced, high-volume manufacturing environment.


• Demonstrated ability to lead, coach, and develop engineers and technicians.


• Strong teamwork, leadership, and continuous improvement mindset.


• Proactive, accountable, and results-oriented approach.

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.