Assembly Customer Facing Program Manager

Experior Technology; Malaysia; On-site; MYR 120,000 - 160,000; Full time

Job summary

A leading semiconductor company in Malaysia is seeking an experienced Assembly Customer Facing Program Manager to oversee wafer sort operations. The ideal candidate will have 5-10 years of experience in semiconductor assembly, strong communication skills, and fluency in English and Mandarin. This is a key role that drives operational excellence and ensures customer satisfaction through effective liaison and process improvement.

Qualifications

• 5-10 years’ experience in assembly including WLCSP, FCBGA and QFN processes.
• Deep understanding of assembly line setup, process flow, and yield improvement.
• Strong background in implementing corrective actions based on quality metrics.

Responsibilities

• Oversee wafer sort test operations and output.
• Serve as the single point of contact for customer requests.
• Coordinate internal teams to support customer needs.

Skills

Technical expertise in semiconductor assembly

Troubleshooting complex manufacturing issues

Proactive in continuous process improvement

Fluency in English and Mandarin

Good presentation and communication skills

Job description

Assembly Customer Facing Program Manager

We are looking for an experienced Assembly Customer Facing Program Manager to serve as the key liaison between our wafer sort operations and customers. This role is ideal for someone with strong technical expertise in semiconductor assembly and a passion for driving operational excellence while ensuring customer satisfaction.

Roles and Responsibilities

• Will be responsible to oversee and drive progress of wafer sort test operations and output
• Will be the single point contact to all wafer sort customer requests covering planning, technical requirements, operational updates including output, quality and issues
• Will be the coordinator of internal teams to support customer requests

Qualification

• Assembly background with 5-10 years’ experience and possess expertise in WLCSP, FCBGA and QFN (flip chip/ wire bond) assembly processes
• Deep understanding of assembly line setup, process flow, and yield improvement for these technologies
• Proven ability to troubleshoot complex manufacturing issues related to these packages, including defect analysis and root cause identification
• Strong background in implementing corrective actions based on customer feedback and internal quality metrics
• Proactive in continuous process improvement to meet customer expectations and contractual requirements
• Knowledge of industry standards and best practices in semiconductor assembly
• Can read/write/speak fluent English and Mandarin (for engaging with China and Taiwan companies)
• Good presentation and communication skills