Principal Engineer, Process

POET Technologies; Penang; On-site; MYR 120,000 - 210,000; Full time

Job summary

POET Technologies in Penang seeks a Process Engineer focused on Middle-of-Line with Front-of-Line knowledge to develop, optimize, and sustain MOL processes in optical engines and module assembly. You will drive yield, quality, cost, and cycle time improvements, collaborating with product, quality, manufacturing, and supply chain teams.

The role requires a Bachelor’s or Master’s degree in engineering and 12+ years in semiconductor or high-tech manufacturing, with hands-on MOL and FOL experience,

Qualifications

• Bachelor’s or Master’s degree in Electrical, Electronic, Mechanical, Mechatronics or related engineering.
• 12+ years in semiconductor, electronics, or high-tech manufacturing.
• Hands-on MOL process expertise and semiconductor assembly knowledge.

Responsibilities

• Own and optimize MOL processes including attach, dispensing, reflow and jetting.
• Maintain knowledge of FOL processes and integration with MOL activities.
• Establish process parameters, control plans and work instructions.
• Design and execute DOE for optimization; perform SPC analysis.
• Lead yield improvement via root-cause analyses (8D, Fishbone, FMEA).
• Support NPI by defining flows, tooling, and qualifications (IQ/OQ/PQ).
• Collaborate with equipment engineers on specs, installation and troubleshooting.
• Qualify new materials for cost and performance; document processes for ISO/quality.

Skills

Analytical thinking

Problem solving

Cross-functional collaboration

Education

Bachelor’s or Master’s degree in Electrical/Electronic/Mechanical/Mechatronics or related engineering fields

Tools

DOE

SPC

FMEA

8D

Yield data analysis

Job description

The Process Engineer (Middle-of-Line focus with Front-of-Line knowledge) will be responsible for developing, optimizing, and sustaining MOL processes in optical engines and module assembly. This role ensures seamless integration with FOL processes to drive yield, quality, cost, and cycle time improvements. The engineer will collaborate with cross-functional teams and contract manufacturers to support high-volume production and new product introductions.

Responsibilities

• Own and optimize MOL processes (chip/component attach, dispensing, reflow, solder ball jetting, transfer, pick & place).
• Maintain working knowledge of FOL processes (die attach, flip chip, eutectic bonding, wire bonding).
• Establish process parameters, control plans, and work instructions to ensure robust manufacturing.
• Design and execute DOE for process optimization and perform SPC analysis to prevent excursions.
• Perform process characterization, window definition, and robustness studies.
• Lead yield improvement initiatives through root cause analysis (8D, Fishbone, FMEA).
• Support NPI by defining process flows, tooling, materials, and leading process qualifications (IQ/OQ/PQ).
• Collaborate with equipment engineers on specifications, installation, qualification, and troubleshooting.
• Evaluate and qualify new materials (adhesives, substrates, fibers, components) for cost and performance optimization.
• Develop and maintain documentation (process flows, WI, control plans, FMEA) ensuring ISO/quality compliance.
• Train production personnel and CM partners on new processes and updates.
• Provide technical leadership and collaborate with Product, Quality, Manufacturing, and Supply Chain teams to resolve process-related issues.

Requirements

• Bachelor’s or Master’s degree in Electrical, Electronic, Mechanical, Mechatronics, or related engineering fields.
• Minimum 12 years of experience in semiconductor, electronics, or high-tech manufacturing.
• Strong knowledge of semiconductor assembly and photonics packaging, with hands-on MOL process expertise.
• Ability to perform process characterization, window definition, and robustness studies.
• Proficiency in DOE, SPC, FMEA, 8D, and yield/data analysis; familiarity with optical testing and alignment is advantageous.
• Strong analytical and problem-solving skills with effective communication across global and cross-functional teams.
• Independent, proactive, and results-driven mindset in fast-paced environments; exposure to silicon photonics or optical module packaging is a plus.