Failure Analysis Section Head (Penang)

Michael Page; George Town; Hybrid; MYR 180,000 - 260,000; Full time

Benefits offered by this job

Hybrid working

Flexible hours

Job summary

Michael Page is recruiting for a multinational semiconductor client in Penang, Malaysia. The role leads a Failure Analysis team, performing die-level electrical and physical failure analyses and guiding corrective actions across product and manufacturing groups.

The position requires a degree in engineering and 7+ years in semiconductors with strong analytical and leadership capabilities, plus the ability to manage multiple priorities in a fast-paced environment.

Qualifications

• Bachelor's degree in a relevant engineering field.
• 7+ years in the semiconductor industry.
• Hands-on expertise in failure analysis methodologies and lab techniques.
• Leadership experience in mentoring teams.
• Strong analytical and root cause investigation skills.
• Effective stakeholder management and communication.

Responsibilities

• Perform electrical and physical failure analysis, including die-level investigations.
• Utilise FA tools and techniques such as SEM, EDX, X-ray, thermal hotspot analysis, curve tracing, laser and chemical decapsulation, delayering, and microprobing.
• Prepare comprehensive technical reports with methodologies, findings, conclusions and corrective recommendations.
• Interpret drawings and schematics to correlate failure modes with test results.
• Maintain and manage failure analysis equipment and laboratory resources.
• Lead, mentor and develop a team of Failure Analysis technicians.
• Present monthly failure analysis reports and updates to management.
• Collaborate with Product, Test, Assembly, Reliability Engineering, and QA to identify root causes and implement corrective actions.
• Support customer return investigations and quality escalations.

Skills

Leadership

Analytical thinking

Root cause analysis

Stakeholder management

Communication

Education

Bachelor's Degree in Mechanical Engineering

Bachelor's Degree in Mechatronics Engineering

Bachelor's Degree in Electronics Engineering

Bachelor's Degree in Electrical Engineering

Tools

SEM

EDX

X-ray

Thermal hotspot analysis

Laser decapsulation

Chemical decapsulation

Delayering

Microprobing

Job description

• Be the Subject Matter Expert for Failure Analysis Excellence
• Expand Your Leadership Career While Staying Hands-On Technically

About Our Client

Our client is a well-established multinational semiconductor organisation that develops and manufactures advanced electronic components used across industrial, automotive, communications, and consumer applications. The company is recognised for its engineering excellence, innovation-driven culture, and commitment to product quality and reliability.

Job Description

• Perform electrical and physical failure analysis, including die-level investigations.
• Utilise specialised FA tools and techniques such as SEM, EDX, X-ray, thermal hotspot analysis, curve tracing, laser and chemical decapsulation, delayering, and microprobing.
• Prepare comprehensive technical reports highlighting methodologies, findings, conclusions, and corrective recommendations.
• Interpret technical drawings and electrical schematics to correlate failure modes with test results.
• Maintain and manage failure analysis equipment and laboratory resources.
• Lead, mentor, and develop a team of Failure Analysis technicians.
• Present monthly failure analysis reports and investigation updates to management.
• Partner with Product, Test, Assembly, Reliability Engineering, and QA teams to identify root causes and implement corrective actions.
• Support customer return investigations and quality escalations.

The Successful Applicant

• Bachelor's Degree in Mechanical, Mechatronics, Electronics, or Electrical Engineering.
• More than 7 years of semiconductor industry experience.
• Hands-on expertise in failure analysis methodologies, tools, and laboratory techniques.
• Strong analytical and root cause investigation skills.
• Experience leading teams and managing technical investigations.
• Effective stakeholder management and communication skills.
• Ability to manage multiple priorities in a fast-paced manufacturing environment.

What's on Offer

• Hybrid working arrangement with work-from-home flexibility.
• Flexible working hours.
• Opportunity to work with advanced semiconductor technologies and failure analysis equipment.
• Exposure to regional and global engineering teams.
• Leadership responsibility with career progression opportunities.
• Collaborative and innovation-focused work environment.

Quote job ref: JN-102026-7131360