Staff Failure Analysis Engineer IC

Power Integrations

Malaysia

Presencial

MYR 80 000 - 120 000

Tempo integral

14 dias+

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Resumo da oferta

Power Integrations Malaysia is seeking a Staff Silicon Level Failure Analysis Engineer to perform device-level failure analysis and support internal engineering, RMA, and customer issues.

You will isolate faults, characterize defects in power IC devices, and prepare comprehensive reports. The role requires documenting results and delivering corrective actions to customers, with emphasis on clear written and spoken English. Mandarin skills are a plus.

Qualificações

  • Minimum 5 years in failure analysis of power semiconductors or mixed-signal devices.
  • Hands-on use of FA tools (ATE, probing, microscopy, XRAY, FIB/SEM) to identify root causes.
  • Strong understanding of CMOS/bipolar devices and IC fabrication.

Responsabilidades

  • Perform fault isolation and defect analysis on power ICs for product failures.
  • Provide technical reports to internal teams and customers detailing findings.
  • Recommend corrective actions based on analysis results.
  • Communicate results clearly to customers and drive design/process improvements.
  • Interact with customers to address questions about failure analysis results.

Conhecimentos

Failure analysis
Electrical fault isolation
IC device knowledge
Technical reporting

Formação académica

Bachelor's in Electronic Engineering
M.S.E.E. preferred

Ferramentas

ATE
Curve tracing
Micro-probing
OBIRCH/EMMI microscopy
X-ray
FIB/SEM
CSAM

Descrição da oferta de emprego

Position: Staff Silicon Level Failure Analysis Engineer
Job Location: PI Malaysia
Job Description:

The Staff Silicon Level Failure Analysis Engineer will perform device level failure analysis to support internal engineering, RMA, and customer issues.

Responsibilities:
  • Performing fault isolation and defect analysis/characterization on power IC’s to identify root causes of product failures in power supply applications and/or in production test.
  • Provide comprehensive technical reports to customers on findings from product failure investigations.
  • Provide corrective actions to internal and external customers based on the results of the analysis.
  • Responsibility will also include effective verbal and written communication of results, which will be used to drive improvements in product design, process technology, and applications. Such communication will require, but not limited to, writing cogent and convincing technical reports suitable for external customers.
  • Communicate with customers as necessary to address customer’s questions and concerns about failure analysis results.
Requirements:
  • Minimum of 5 years of experience in failure analysis of power semiconductors, analog, and/or mixed signal IC devices.
  • Hands-on experience in failure analysis and electrical fault isolation and defect characterization tools and techniques such as the following: ATE, curve trace, nano/micro-probing, OBIRCH/EMMI microscopy, liquid crystal, CSAM, XRAY, FIB, SEM/EDX and manual cross-sectioning and deprocessing techniques using both parallel-polishing and wet chemical etch techniques.
  • In-depth understanding of both digital and analog circuits, device physics and IC fabrication processes.
  • Ability to interpret IC ATE test data log is required. Ability to interpret system level schematics, the IC level schematics, and IC layout of CMOS and bipolar devices is required.
  • Excellent English speaking, reading and technical writing skill is required.
  • Fluent in verbal, reading, and writing skills in Mandarin is preferred.
  • Candidates with direct experience in customer interface on resolution of customer quality problems will be given special consideration.
  • Candidates with background and experience in automotive failure analysis/customer communication will be given special consideration.
  • Preferences will be given to candidates who have a thorough understanding of analog, mixed-signal, or power semiconductor operational characteristics and the ability to perform fault isolation techniques at chip (or IC) level as well as on AC to DC Switch Mode Power Supply system level (or AC/DC SMPS).
Education:

BS in Electronic Engineering or equivalent discipline is required. A candidate with MSEE will be given preference.

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