Staff Failure Engineer

Aitomic Jobs; Malaysia; Hybrid; MYR 180,000 - 320,000; Full time

Job summary

Renesas Electronics in Bayan Lepas, Malaysia, is seeking a Senior Staff Failure Analysis Engineer to lead semiconductor failure investigations for advanced AI-related products. You will drive end-to-end fault isolation, electrical verification, and physical analysis, collaborating with design, process integration, reliability, and manufacturing teams to identify root causes and drive corrective actions.

The role requires hands-on experience with OBIRCH, PEM, TDR, X-Ray, SEM, EDX, and delayering,

Qualifications

• Bachelor's or higher in Electrical/Electronics/Physics or related field.
• 7+ years hands-on semiconductor failure analysis experience.
• Strong knowledge of IC device physics and fault isolation methodologies.

Responsibilities

• Lead end-to-end failure analysis activities for engineering, qualification, reliability, manufacturing, and customer-returned devices.
• Drive corrective and preventive actions with cross-functional teams to improve product quality, yield, and reliability.
• Perform detailed electrical verification and characterization to validate failure signatures and reproduce failure conditions.
• Correlate electrical, physical, design, process, and reliability data to determine root cause of failures.
• Develop innovative FA methodologies and best practices to improve diagnostic efficiency and success rates.
• Prepare comprehensive technical reports and present investigation findings to management and customers.

Skills

Electrical verification

Fault isolation

Physical failure analysis

Schematic interpretation

CAD

Data analysis

Problem solving

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical/Electronics

PhD in a related field

Tools

CAD

SEM

X-Ray

EDX

OBIRCH

PEM

TDR

2D/3D X-Ray

Job description

Short Summary

Staff Failure Engineer with Renesas Electronics. We are seeking a highly motivated and experienced Senior Staff Failure Analysis Engineer to lead complex semiconductor failure analysis investigations for advanced technology and AI-related products. The ideal candidate will possess strong expertise in electrical verification, fault isolation, and physical failure analysis, with a proven track record of resolving challenging…

Key Details

• Position / opportunity: Staff Failure Engineer
• Organization: Renesas Electronics
• Country / coverage: Malaysia
• Location: Bayan Lepas, , Malaysia
• Work arrangement: On-site
• Opportunity type: Jobs
• Sector: Health
• Compensation: Not specified
• Duration: Not specified
• Start date: 2026-08-17
• Application deadline: Not specified

Description

We are seeking a highly motivated and experienced Senior Staff Failure Analysis Engineer to lead complex semiconductor failure analysis investigations for advanced technology and AI-related products. The ideal candidate will possess strong expertise in electrical verification, fault isolation, and physical failure analysis, with a proven track record of resolving challenging product, reliability, and customer-return issues. The role requires close collaboration with design, process integration, product engineering, reliability, and manufacturing teams to identify root causes and drive corrective actions Key Responsibilities Lead end-to-end failure analysis activities for engineering, qualification, reliability, manufacturing, and customer-returned devices. Drive corrective and preventive actions with cross-functional teams to improve product quality, yield, and reliability. Perform detailed electrical verification and characterization to validate failure signatures and reproduce failure conditions. Support technology development, new product introduction, and process qualification activities. Correlate electrical, physical, design, process, and reliability data to determine root cause of failures. Develop innovative FA methodologies and best practices to improve diagnostic efficiency and success rates. Prepare comprehensive technical reports and present investigation findings to management and customers. Utilize advanced fault isolation techniques to localize defects, including but not limited to: OBIRCH Thermal HS Imaging Photon Emission Analysis (PEM) Parametric Analyzer Bench Set Up for Functional Failures Time Domain Reflectometry (TDR) Conduct and interpret physical failure analysis using techniques such as: C-SAM 2D & 3D X-Ray SEM (Scanning Electron Microscopy) EDX Package level and die level delayering and cross-sectioning Material and structural characterization Bachelor's, Master's, or PhD degree in Electrical Engineering , Electronics Engineering, Physics, Semiconductor Engineering, or related disciplines. Minimum 7 years of hands‑on experience in semiconductor failure analysis, including practical execution of fault isolation and physical analysis techniques. Strong knowledge of semiconductor device physics and integrated circuit operation. Proficient in CAD and schematic interpretation. Demonstrated expertise in: Electrical verification and characterization Fault isolation methodologies Physical failure analysis Root cause analysis methodologies Experience with advanced semiconductor technologies and complex IC products. Strong analytical, problem‑solving, and troubleshooting skills. Excellent communication skills with the ability to present technical findings to diverse stakeholders. Ability to manage multiple projects and work effectively in a fast‑paced environment. Preferred Qualifications Experience supporting AI, High‑Performance Computing (HPC), Data Center, GPU, Accelerator, or Advanced Packaging products. Familiarity with AI hardware architectures, advanced nodes, heterogeneous integration, or system‑level failure analysis. Knowledge of reliability testing, ESD, latch‑up, EOS, and silicon debug methodologies. Experience in electrical failure node interpretation, physical analysis and knowledge in Smart Power Stage (SPS) packages. Ability to Interpret CAD layouts, schematics, and design documentation to support failure root cause determination. Previous experience leading cross‑functional technical investigations and customer‑facing failure analysis activities. Programming or data analytics skills are advantageous. Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our…

Responsibilities

• We are seeking a highly motivated and experienced Senior Staff Failure Analysis Engineer to lead complex semiconductor failure analysis investigations for advanced technology and AI-related products.
• The ideal candidate will possess strong expertise in electrical verification, fault isolation, and physical failure analysis, with a proven track record of resolving challenging product, reliability, and customer-return issues.
• The role requires close collaboration with design, process integration, product engineering, reliability, and manufacturing teams to identify root causes and drive corrective actions Key Responsibilities Lead end‑to‑end failure analysis activities for…
• Drive corrective and preventive actions with cross‑functional teams to improve product quality, yield, and reliability.
• Perform detailed electrical verification and characterization to validate failure signatures and reproduce failure conditions.
• Support technology development, new product introduction, and process qualification activities.

Requirements / Eligibility

• , reliability, manufacturing, and customer-returned devices.
• Drive corrective and preventive actions with cross‑functional teams to improve product quality, yield, and reliability.
• Perform detailed electrical verification and characterization to validate failure signatures and reproduce failure conditions.Support technology development, new product introduction, and process qualification activities.Correlate electrical, physical, design, process, and reliability data to determine root cause of failures.