Die Prep Equipment Engineer — MES Deployment & Automation

Texas Instruments; Malaysia; On-site; MYR 70,000 - 110,000; Full time

Job summary

Texas Instruments in Malaysia is seeking a Die Prep Equipment Engineer for an MES project. This on-site, full-time role drives MES rollout for Die Prep/Dicing equipment, defines workflows, and ensures integration readiness.

The candidate should hold a Bachelor's degree in an engineering field and have at least two years of hands-on semiconductor equipment experience. Collaboration across functions is key for reliability and automation improvements.

Qualifications

• Bachelor's degree in an engineering field or related discipline.
• Minimum 2 years of hands-on semiconductor equipment experience in Die Prep/Dicing.
• Experience with MES platforms and integration is preferred.

Responsibilities

• Represent Die Prep equipment engineering during MES rollout and define workflows.
• Translate hardware requirements into digital designs and data collection points.
• Validate integration scenarios and support UAT and deployment.
• Transition to production and leverage MES data for predictive maintenance.

Skills

Die Prep/Dicing equipment

Cross-functional collaboration

Data interpretation

Education

Bachelor's degree in Electrical Engineering

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Chemical Engineering

Tools

Siemens OpCenter MES

MES configuration

Job description

Texas Instruments in Malaysia is seeking a Die Prep Equipment Engineer for an MES project. This on-site, full-time role drives MES rollout for Die Prep/Dicing equipment, defines workflows, and ensures integration readiness.

The candidate should hold a Bachelor's degree in an engineering field and have at least two years of hands-on semiconductor equipment experience. Collaboration across functions is key for reliability and automation improvements.