Technician – Dicing - Pick - Place | Semiconductor Manufacturing

Globetronics Technology Berhad

Bayan Lepas

On-site

MYR 45,000 - 62,000

Full time

4 days ago
Be an early applicant

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Globetronics Technology Berhad in Bayan Lepas, Penang, is seeking a Technician with hands-on experience in Dicing and Pick & Place processes within the semiconductor manufacturing industry. The successful candidate will operate machines, set up, monitor processes, troubleshoot, and support production and engineering to ensure stable production and product quality.

The role requires a technical certificate or diploma in Electrical & Electronic, Mechanical, Mechatronics, or Manufacturing

Qualifications

  • Certificate, diploma, or technical qualification in Electrical & Electronic, Mechanical, Mechatronics or Manufacturing Engineering.
  • 1-3 years of relevant experience in semiconductor manufacturing is preferred.
  • Hands-on experience in Dicing and/or Pick & Place processes.
  • Familiar with wafer/die handling and assembly processes.
  • Able to perform basic machine troubleshooting and parameter adjustment.
  • Understand work instructions, process specs, and machine parameters.
  • Good problem-solving and analytical skills.
  • Willing to work in a shift-based manufacturing environment.

Responsibilities

  • Operate and monitor Dicing and Pick & Place machines according to work instructions.
  • Perform machine setup, product changeover, parameter adjustment, and first-piece verification.
  • Monitor machine and process parameters during production.
  • Perform wafer/die handling and ensure traceability.
  • Conduct in-process inspection and identify defects or abnormalities.
  • Troubleshoot basic machine issues and escalate major problems.
  • Maintain routine cleaning and preventive maintenance.
  • Support engineering trials, process qualification, and NPI activities.
  • Assist Engineers in process optimization and yield improvement.
  • Maintain accurate production, process, and equipment records.
  • Collaborate with Production, Process Engineering, Equipment, and QA teams to resolve issues.
  • Follow ESD, safety, 5S, cleanroom, and quality requirements at all times.

Skills

Dicing machine operation
Pick & Place operation
Wafer/die handling
Troubleshooting
Process monitoring
Quality inspection
Teamwork
Safety compliance

Education

Certificate in Electrical & Electronic, Mechanical, Mechatronics, or Manufacturing Engineering
Diploma in Electrical & Electronic, Mechanical, Mechatronics, or Manufacturing Engineering
Technical qualification in related field

Tools

Basic machine setup

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Position: Technician - Dicing & Pick & Place
Employment Type: Full-Time / Permanent
Industry: Semiconductor Manufacturing
Location: Bayan Lepas, Penang

Job Summary

We are looking for a Technician with hands-on experience in Dicing and Pick & Place processes within the semiconductor manufacturing industry. The successful candidate will be responsible for machine operation, setup, process monitoring, troubleshooting, and supporting production and engineering activities to ensure stable production and product quality.

Key Responsibilities
  • Operate and monitor Dicing and Pick & Place machines according to work instructions and process specifications.
  • Perform machine setup, product changeover, parameter adjustment, and first-piece verification.
  • Monitor machine and process parameters during production.
  • Perform wafer/die handling and ensure proper material identification and traceability.
  • Conduct in-process inspection and identify process abnormalities or defects.
  • Troubleshoot basic machine and process issues and escalate major problems to the Engineer or Equipment team.
  • Perform routine machine cleaning, basic maintenance, and preventive maintenance activities.
  • Support engineering trials, process qualification, NPI, and continuous improvement activities.
  • Assist Engineers in process optimization and yield improvement.
  • Maintain accurate production, process, and equipment records.
  • Work closely with Production, Process Engineering, Equipment, and QA teams to resolve production and quality issues.
  • Follow ESD, safety, 5S, cleanroom, and quality requirements at all times.
Requirements
  • Certificate, Diploma, or Technical qualification in Electrical & Electronic, Mechanical, Mechatronics, Manufacturing Engineering, or related field.
  • 1-3 years of relevant experience in semiconductor manufacturing is preferred.
  • Hands-on experience in Dicing and/or Pick & Place processes.
  • Familiar with semiconductor wafer/die handling and assembly processes.
  • Able to perform basic machine troubleshooting and parameter adjustment.
  • Able to understand work instructions, process specifications, and machine parameters.
  • Good problem-solving and analytical skills.
  • Able to work independently and as part of a team.
  • Willing to work in a shift-based manufacturing environment.
Preferred Skills
  • Dicing machine operation and setup.
  • Pick & Place machine operation.
  • Semiconductor assembly process knowledge.
  • Basic equipment troubleshooting and preventive maintenance.
  • Process monitoring and quality inspection.
  • Good teamwork, communication, and discipline.
Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Technician – AOI, Cleaning, Underfill - PCB Mounter
Technician – AOI, Cleaning, Underfill - PCB Mounter

Globetronics Technology Berhad • Bayan Lepas

On-site
MYR 36,000 - 60,000
Dicing Engineer – Semiconductor Manufacturing
Dicing Engineer – Semiconductor Manufacturing

Globetronics Technology Berhad • Bayan Lepas

On-site
MYR 60,000 - 95,000
Semiconductor Technician
Semiconductor Technician

ASE Electronics Malaysia • Bayan Lepas

On-site
MYR 39,000 - 58,000
Annual Leave
Medical and Hospitalisation Leave
EPF
+3
Production Technician (Gross up to RM3,800 - Meal Allowance - 15 Days AL)
Production Technician (Gross up to RM3,800 - Meal Allowance - 15 Days AL)

Kanry Search • Pasir Gudang

On-site
MYR 23,000 - 39,000
Transport allowance
Meal card
Shift allowance
+3
SEMICONDUCTOR ASSEMBLER 1
SEMICONDUCTOR ASSEMBLER 1

NXP Limited • Kuala Lumpur

On-site
MYR 28,000 - 39,000
Assembly Equipment Engineer
Assembly Equipment Engineer

TF-AMD Penang • Bayan Lepas

On-site
MYR 60,000 - 80,000
Technician
Technician

OSA Technologies Sdn Bhd • Kampung Sekolah Simpang Ampat

On-site
MYR 29,000 - 42,000
Technician (Process, Mechanical, Test) - Die attach & wire bond
Technician (Process, Mechanical, Test) - Die attach & wire bond

Nationgate Solution (M) Sdn Bhd • Seberang Perai

On-site
MYR 40,000 - 64,000
Process Engineer (Semiconductor)
Process Engineer (Semiconductor)

Chain Top Technology (Malaysia) Sdn Bhd • Kulim

On-site
MYR 39,000 - 61,000
Competitive salary
13th-month basic salary
Medical benefits
+4
SEMICONDUCTOR ASSEMBLER I
SEMICONDUCTOR ASSEMBLER I

NXP Limited • Kuala Lumpur

On-site
MYR 22,000 - 31,000