Wafer Dicing Process Engineer – Yield & NPI

Globetronics Technology Berhad; Bayan Lepas; On-site; MYR 60,000 - 95,000; Full time

Job summary

Globetronics Technology Berhad in Bayan Lepas, Penang, is seeking a Dicing Process Engineer to lead wafer dicing/sawing process development and optimization for semiconductor manufacturing. The role includes process qualification, DOE, SPC, and yield improvement to support production and NPI.

You will work with Equipment, Production, QA, and NPI teams to resolve issues, ensure specifications, and drive projects that improve yield, quality, cost, and productivity.

Qualifications

• 2–5 years of relevant experience in semiconductor manufacturing.
• Hands-on experience with dicing/sawing processes and equipment.
• Knowledge of DOE, SPC, and yield improvement.

Responsibilities

• Develop, establish, and optimize wafer dicing/sawing processes to meet product quality and yield requirements.
• Set up and optimize dicing process parameters including spindle speed, cutting speed, blade selection, feed rate, cooling water, and cut depth.
• Perform process trials, DOE, qualification, and validation for new and existing products.
• Support NPI, engineering builds, product transfer, and new process introduction.
• Drive continuous improvement using SPC and other quality tools.

Skills

Dicing/sawing processes

Analytical thinking

Troubleshooting

Cross-functional teamwork

Education

Bachelor's degree in Mechanical, Electrical & Electronic, Mechatronics, Manufacturing, Materials Engineering

Tools

DISCO wafer dicing equipment

Job description

Globetronics Technology Berhad in Bayan Lepas, Penang, is seeking a Dicing Process Engineer to lead wafer dicing/sawing process development and optimization for semiconductor manufacturing. The role includes process qualification, DOE, SPC, and yield improvement to support production and NPI.

You will work with Equipment, Production, QA, and NPI teams to resolve issues, ensure specifications, and drive projects that improve yield, quality, cost, and productivity.