ChipFab Product/Process Engineer

Broadcom; Penang; On-site; MYR 300,000 - 540,000; Full time

Job summary

Broadcom, Inc. is seeking an senior engineering leader to drive the ramp-up of new facilities and the qualification of contract manufacturers, new equipment and processes for seamless mass production.

You will oversee cross-functional teams to ensure aggressive capacity scaling on schedule and manage the transition from NPI to high-volume manufacturing. You will monitor yields across CM partners, lead quality audits, and drive continuous improvements using JMP for data-driven decision-making.

Qualifications

• Bachelor’s or Master’s degree in engineering or a related highly technical field.
• 10+ years of hands-on engineering and leadership in backend InP wafer processing or complex semiconductor/photonics manufacturing.
• Familiarity with Bar Processing equipment such as Bar Stacker/unstack, Scribe & Break, AOI, and Pick & Place.
• Strong leadership with experience managing remote teams and cross-functional initiatives.
• Expertise in product and process yield improvement methodologies, complex problem-solving, and equipment qualification.
• Highly proficient in JMP software for statistical data analysis and critical decision-making.
• Excellent communication, negotiation, and project management skills.

Responsibilities

• Lead ramp-up of new facilities and aggressive capacity scaling within strict project timelines.
• Lead cross-functional team in evaluation, qualification, and onboarding of new CM partners, new equipment, and manufacturing processes.
• Drive seamless transfer of products from NPI to High-Volume Manufacturing (HVM).
• Monitor production yields across contract manufacturers and drive yield improvements.
• Resolve daily CM engineering, production, and quality issues with robust corrective actions.
• Oversee product cost analyses and identify cost-reduction opportunities.
• Data-driven analysis of CM performance using JMP to troubleshoot deviations.
• Conduct on-site quality audits at partner facilities and lead root cause investigations.

Skills

Leadership

Remote team leadership

Cross-functional collaboration

Problem solving

Communication

Project management

Data analysis

Education

Bachelor’s or Master’s degree in engineering (Mechanical/Electrical & Electronics, Semiconductor, or related highly technical field)

Tools

JMP

AOI

Scribe & Break

Bar processing equipment

Pick & Place

Job description

Job Description

New Facilities & Production Ramp-Up: Lead the team to ramp-up new facilities, ensuring aggressive capacity scaling are consistently achieved within strict project timelines.

New Equipment, Process & CM Qualification: Lead the cross functional team in the evaluation, qualification, and strategic onboarding of new Contract Manufacturing (CM) partners, new equipment, and manufacturing processes to ensure a seamless transition into mass production.

New Product Transfer & Technical Ownership: Drive for seamless transition of products from New Product Introduction (NPI) to High-Volume Manufacturing (HVM), acting as the first line of technical defense for all product-related issues on the factory floor.

Yield Stabilization & Enhancement: Monitor production yields across contract manufacturers. Proactively identify yield issue such as Low Yield Triggered , On-Hold Rate, Rework Rate and drive for improvement.

Line Sustaining, drive for process yield Improvement: Resolve daily CM engineering, production, and quality issues by implementing robust corrective actions and driving continuous process improvement initiatives.

Product Costing Management: Oversee product cost analysis and proactively identify opportunities for cost reduction through process optimization, yield enhancement, and cycle time improvements.

Data-Driven Engineering Analysis: Drive to monitor CM performance metrics and troubleshoot complex manufacturing deviations utilizing advanced analytical software (e.g., JMP).

Customer Quality Assurance: Conduct rigorous on-site quality audits at partner facilities to enforce strict adherence to Standard Operating Procedures (SOPs), Process Control Plans (PCPs), and overarching quality standards. Drive Contract Manufacturers (CMs) to promptly resolve customer quality issues by leading root cause investigations, implementing robust corrective actions (CA), and tracking their long-term effectiveness.

Requirements

Bachelor’s or Master’s degree in Mechanical/Electrical & Electronics Engineering, Semiconductor Manufacturing, Fiber Optics/Photonics Product Engineering, or a related highly technical field.

Minimum 10+ years of hands-on engineering and leadership experience in backend Indium Phosphide InP wafer processing (from wafer to chip-out) or complex semiconductor/photonics manufacturing.

Familiarity with Bar Processing such Bar Stacker/unstack, Scribe & Break, AOI, and Pick & Place will be an added advantage.

Strong leadership capabilities with a proven history of managing remote teams, driving cross-functional initiatives, and successfully leading new facility or production line ramp-ups.

Extensive expertise in product and process yield improvement methodologies, complex problem-solving, and equipment qualification.

Highly proficient in JMP software, with a strong capability to leverage it for complex statistical data analysis and critical decision-making.

Excellent communication, negotiation, and project management skills, with the ability to influence external partners and internal stakeholders effectively.

Equal Opportunity Statement

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

About Broadcom

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.