Assistant Manager Engineering (Failure Analysis & Reliability)

TF AMD MICROELECTRONICS (PENANG) SDN. BHD.; Penang; On-site; MYR 180,000 - 260,000; Full time

Benefits offered by this job

Medical

Miscellaneous allowance

Education support

Dental

Parking

Sports (Gym)

Vision Insurance coverage

Vehicle Interest Subsidy

Job summary

TF AMD MICROELECTRONICS (PENANG) SDN. BHD. seeks an experienced Assistant/Section Manager Engineering (Failure Analysis & Reliability) to lead the FA team in Penang, Malaysia. You will drive technical excellence, root cause investigations, and continuous improvement across advanced packaging technologies.

You will manage a team, establish KPIs, and collaborate with multiple functions to ensure timely, high-quality failure analysis and reliability outcomes for customer programs.

Qualifications

• Bachelor's or Master's Degree in Electrical/ Electronics/ Materials Science/ Mechanical Engineering (or related).
• 8–15 years in Semiconductor FA, Backend Manufacturing, Advanced Packaging, or related operations.
• Strong knowledge of FA, packaging, and assembly processes.
• Hands-on experience with FA equipment and techniques (SEM, FIB, TDR, CSAM, X-Ray, cross-sectioning, grinding, etching, REL tester).
• Experience supporting high-volume manufacturing and customer programs.
• Demonstrated leadership in managing technical teams, solving problems, and handling escalations.

Responsibilities

• Lead FA team with engineers, technicians, and specialists.
• Oversee FA operations including customer returns and reliability failures.
• Lead investigations for advanced packaging FA (FC/FC-BGA, WLCSP, FO, SiP, BGA).
• Drive root-cause analysis using 8D, DMAIC/Six Sigma, FMEA, and Fishbone analyses.
• Collaborate with Process, Product, Manufacturing, Test, Quality, and Reliability teams.

Skills

Leadership

Root Cause Analysis

Data Analysis

Education

Bachelor's/Master's in Electrical/Electronics Engineering, Materials Science, or Mechanical Engineering

Tools

SEM

FIB

TDR

CSAM

X-Ray

Cross-Sectioning

Grinding

Wet Etching

Reliability Tester

Job description

Assistant Manager Engineering (Failure Analysis & Reliability)

TF AMD MICROELECTRONICS (PENANG) SDN. BHD. is seeking an experienced and dynamic Assistant/Section Manager Engineering (Failure Analysis & Reliability) to lead our Failure Analysis (FA) team in Penang, Malaysia.

In this role, you will be responsible for leading a team of engineers and specialists while overseeing failure analysis and quality engineering activities to support advanced semiconductor packaging technologies. You will drive technical excellence, root cause investigations, customer satisfaction, and continuous improvement initiatives to ensure the highest standards of quality, reliability, and operational performance.

Key Responsibilities

Leadership & Team Management

Lead, mentor, and develop a team of Failure Analysis (FA) engineers, technicians, and specialists.

Establish clear goals, KPIs, and priorities aligned with business objectives and customer requirements.

Manage manpower planning, workload distribution, and competency development programs.

Foster a culture of technical excellence, accountability, collaboration, and continuous improvement.

Failure Analysis Operations

Oversee end-to-end failure analysis activities, including customer returns (RMA), electrical failures, assembly and packaging defects, and reliability test failures.

Ensure timely turnaround while maintaining high-quality analysis standards.

Review, validate, and approve FA reports prior to release to customers and stakeholders.

Establish and maintain standardized FA methodologies, workflows, and documentation practices.

Advanced Packaging Failure Analysis

Lead failure investigations for advanced semiconductor packaging technologies, including Flip Chip (FC/FC-BGA), Wafer-Level Chip Scale Package (WLCSP), Fan-Out (FO), System-in-Package (SiP), BGA, and related technologies.

Identify and characterize failure mechanisms such as solder joint cracking, delamination, voiding, package warpage, die cracking, underfill defects, RDL, TSV, bump, and interconnect failures.

Provide technical guidance on advanced failure analysis techniques and methodologies.

Root Cause Analysis & Problem Solving

Drive structured root cause investigations using 8D, DMAIC/Six Sigma, FMEA, and Fishbone Analysis methodologies.

Lead the implementation of effective Corrective and Preventive Actions (CAPA).

Eliminate recurring issues and drive sustainable corrective actions.

Cross-Functional Collaboration

Collaborate closely with Process Engineering, Product Engineering, Manufacturing, Test Engineering, Quality, and Reliability teams.

Support New Product Introduction (NPI), qualification activities, and technology transfers.

Partner with customers, suppliers, subcontractors, and internal stakeholders on joint investigations and improvement initiatives.

Serve as the technical lead for customer-related FA issues and escalations.

Present failure analysis findings, root causes, and corrective action plans to customers.

Ensure professional and effective communication with all stakeholders.

Deliver solutions that meet customer expectations and industry standards.

Analyze FA data to identify defect trends, systemic issues, and improvement opportunities.

Drive yield improvement, defect reduction, and reliability enhancement initiatives.

Apply statistical and data-driven methodologies to support decision-making.

Continuously improve FA capabilities, processes, and operational efficiency.

Laboratory Operations & Capability Development

Manage FA laboratory operations, including equipment maintenance, calibration, and utilization.

Ensure compliance with ESD requirements, safety regulations, internal procedures, and audit standards.

Lead laboratory capability expansion to support emerging technologies and business needs.

Manage budget planning and capital investment for FA equipment and tools.

Performance Monitoring & Reporting

Define, monitor, and report key performance indicators (KPIs), including:

Failure Analysis Turnaround Time (TAT)

Yield Improvement Contribution

Prepare regular performance reports for management and stakeholders.

Maintain documentation integrity and audit readiness.

Qualifications & Experience

Bachelor's or Master's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, or a related discipline.

Minimum 8–15 years of experience in Semiconductor Failure Analysis (FA), Backend Manufacturing, Advanced Packaging, or related semiconductor operations.

Strong understanding of failure mechanisms, material interactions, semiconductor packaging, and assembly processes.

Hands-on experience with FA equipment and techniques, including SEM, FIB, TDR, CSAM, X-Ray, mechanical cross-sectioning, grinding, wet etching, REL tester and other advanced FA methodologies.

Proven experience supporting high-volume manufacturing environments and key customer programs.

Demonstrated leadership experience in managing technical teams, driving problem resolution, and handling customer escalations.

Preferred Qualifications

Experience in Bumping, Wafer-Level Packaging (WLP), and Advanced Packaging technologies.

Exposure to OSAT (Outsourced Semiconductor Assembly and Test) or semiconductor foundry environments.

Experience working with global customers and cross-functional international teams.

Familiarity with advanced failure analysis tools, characterization techniques, and methodologies.

Knowledge of quality and problem-solving methodologies such as 8D, FMEA, Six Sigma, and CAPA.

Strong analytical, troubleshooting, and root cause analysis skills.

Effective leadership, coaching, and team development capabilities.

Excellent communication, presentation, and stakeholder management skills.

Customer-focused mindset with strong business acumen.

Data-driven decision-making and continuous improvement orientation.

Ability to thrive in a fast-paced manufacturing environment and manage multiple priorities effectively.

Perks and benefits

• Medical
• Miscellaneous allowance
• Education support
• Dental
• Parking
• Sports (e.g. Gym)
• Vision Insurance coverage
• Vehicle Interest Subsidy

Consumer Electronics Manufacturing 1,001-5,000 employees

Unleash your potential with the advanced leading-edge semiconductor and ground breaking technology company - TF AMD

TF AMD Microelectronics (Penang) Sdn. Bhd., the 1st company in the world to assemble and test the leading microprocessor. The remarkable world class assembly and test Multichip Module (MCM) microprocessor has been successfully manufactured at TF AMD since 2019.

Our Core Business in Assembly and Test Microprocessors. Graphics Processors and Gaming Consoles. TF AMD has advanced facilities and technology with ground breaking dominant to develop top cutting-edge technologies that push the boundaries of what’s possible throughout the major assembly and test plant.

Unleash your potential with the advanced leading-edge semiconductor and ground breaking technology company - TF AMD

TF AMD Microelectronics (Penang) Sdn. Bhd., the 1st company in the world to assemble and test the leading microprocessor. The remarkable world class assembly and test Multichip Module (MCM) microprocessor has been successfully manufactured at TF AMD since 2019.

Our Core Business in Assembly and Test Microprocessors. Graphics Processors and Gaming Consoles. TF AMD has advanced facilities and technology with ground breaking dominant to develop top cutting-edge technologies that push the boundaries of what’s possible throughout the major assembly and test plant.

What can I earn as an Engineering Manager