Assistant Engineer - Die Bond & Wire Bond NPI Support

Vishay Intertechnology, Inc.; Kampung Krubong; On-site; MYR 39,000 - 56,000; Full time

Job summary

Vishay Semiconductor Malaysia Sdn. Bhd. in Krubong, Melaka invites applications for an Assistant Engineer role to support Die Bond and Wire Bond process development in a fast-paced R&D environment.

The position focuses on planning engineering builds, DOE, data analysis, and qualification activities, with opportunities to work on new product introductions and equipment qualification. This role offers hands-on development experience in semiconductor assembly and a pathway to grow within Vishay’s

Qualifications

• Diploma in Engineering with semiconductor focus.
• Minimum of 2 years of relevant working experience.
• Basic understanding of semiconductor assembly and packaging processes.
• Knowledge of Die Bond and Wire Bond processes, SPC, DOE.
• Strong analytical, communication, and teamwork skills.
• Proficient in Microsoft Office applications and data analysis tools.
• Able to work independently in a fast-paced R&D environment.

Responsibilities

• Support development and optimization of Die Bond and Wire Bond assembly processes for new product introductions (NPI).
• Plan and execute engineering builds, DOE (Design of Experiments), and process characterization activities.
• Collect, analyze, and interpret engineering data from process trials and qualifications.
• Generate technical reports, qualification summaries, and presentations.
• Support evaluation and qualification of new Die Bond and Wire Bond equipment.

Skills

Die Bond know-how

Wire Bond know-how

DOE

SPC

Data analysis

Teamwork

Communication

Education

Diploma in Engineering (Semiconductor)

Tools

Die Bond equipment

Wire Bond equipment

Job description

Vishay Semiconductor Malaysia Sdn. Bhd. in Krubong, Melaka invites applications for an Assistant Engineer role to support Die Bond and Wire Bond process development in a fast-paced R&D environment.

The position focuses on planning engineering builds, DOE, data analysis, and qualification activities, with opportunities to work on new product introductions and equipment qualification. This role offers hands-on development experience in semiconductor assembly and a pathway to grow within Vishay’s