Semiconductor Process Engineer – Die Bond & Wire Bond

Vishay Intertechnology; Malacca City; On-site; MYR 70,000 - 100,000; Full time

Benefits offered by this job

Health care coverage

Financial support programs

Other resources

Job summary

Vishay Intertechnology is seeking a Process Engineer to lead pre-assembly, die bond and wire bond processes at Krubong, Melaka, Malaysia. The role focuses on process optimization, RCA and DOE to deliver yield improvements.

You will collaborate cross-functionally and manage projects while applying DOE, SPC and material/process specification writing skills in a semiconductor environment. A Bachelor’s degree and 5+ years of related experience are required.

Qualifications

• Minimum 5 years of relevant IC/semiconductor experience
• Experience in Wire Bond, Die Attach and Pre-Assembly
• Knowledge of SPC, QCC 7 tools and problem-solving
• Material, Process and Specification writing knowledge
• Process engineering and project management experience is a plus

Responsibilities

• Pre-Assembly process responsibilities and optimization
• Die Bond & Wire Bond process troubleshooting and optimization
• Yield improvement and defect reduction
• Root Cause Analysis (RCA) and line audits
• DOE for process improvement projects and cross-functional collaboration
• Evaluate raw materials for cost saving and lead-time reduction

Skills

Wire Bond

Die Attach

DOE

Root Cause Analysis

SPC

Education

Bachelor’s Degree in Mechanical / Manufacturing / Electrical / Electronic engineering

Job description

Vishay Intertechnology is seeking a Process Engineer to lead pre-assembly, die bond and wire bond processes at Krubong, Melaka, Malaysia. The role focuses on process optimization, RCA and DOE to deliver yield improvements.

You will collaborate cross-functionally and manage projects while applying DOE, SPC and material/process specification writing skills in a semiconductor environment. A Bachelor’s degree and 5+ years of related experience are required.