Advanced Package AutoCAD ME Drafter

mnosys sdn bhd; Bayan Lepas; On-site; MYR 67,000 - 100,000; Full time

Job summary

mnosys sdn bhd in Penang, Malaysia, is seeking a skilled draftsman to support semiconductor package development and data migration. You will transform legacy drawings to Infineon standards and ensure data integrity across systems, collaborating with stakeholders to migrate documents and drawings into the SAP/oneSAP environment.

The role requires proficiency in AutoCAD, experience with bond diagrams and package drawings, and the ability to work independently after training, with strong

Qualifications

• Experience with technical drawings and data management.
• Proficient in AutoCAD drafting.
• Experience with semiconductor package drawings preferred.
• Strong written and verbal communication.
• Independent with minimal supervision after training.

Responsibilities

• Support package development and documentation setup for assembled products.
• Perform gap analysis and convert legacy drawings to Infineon standards.
• Support data migration to Infineon Master Data standard tools.
• Coordinate with stakeholders on documents, drawings, and data migration to SAP/oneSAP.

Skills

AutoCAD

Bond diagrams

Package drawings

Leadframe drawings

Semiconductor packages

Data documentation

Excel

PowerPoint

SAP DMS

Tools

oneSAP

SAP DMS

Job description

1. Support semiconductor package development and integration projects in technical drawings/documents setup for assembled and finished products.

2. Perform gap analysis and convert existing legacy technical drawings/documents format, structure, templates into Infineon standard, specification and compliance.

3. Sustain data integrity and support data migration of his/her work package to Infineon Master Data standard tools

4. Coordinate with relevant stakeholders in technical documents, technical drawings and data migration from legacy Data Management System to oneSAP System.

Technical / Functional Competencies

1. Must be proficient in AutoCAD drafting application.

2. Must have experience working on bond diagram, bond cells, Package Outline Drawing.

3. Good exposure to substrate/leadframe drawing design and semiconductor packages is highly desirable

4. Must be familiar with drafting and technical drawing data documentation and data management.

5. Good knowledge of Excel, PowerPoint

6. SAP DMS system knowledge is a distinct advantage.

7. Independent with good analytical analysis, able to work with minimum supervision after initial training.

8. Good written and speaking skills, this job requires communication in different forums.