Principal Engineer Package Technology

Infineon Technologies; Malacca City; On-site; MYR 300,000 - 600,000; Full time

Job summary

Infineon Technologies in Malaysia seeks a Principal Engineer for Package Technology to lead packaging solution development from concept through realization. You will be the technical expert for package design, assembly technologies and BE processes, driving innovation and cross-functional collaboration across teams and projects.

The role demands deep expertise in packaging, strong analytical and negotiation skills, and the ability to develop robust, competitive solutions while advancing

Qualifications

• Deep expertise in semiconductor packaging, assembly and test technologies.
• Strong understanding of BE processes, materials, package reliability, and quality requirements.
• Excellent analytical, communication, negotiation and stakeholder management skills.

Responsibilities

• Lead the definition, design and development of packaging solutions from concept to realization.
• Act as technical expert and consultant for package design and assembly technologies.
• Drive innovation, cross-functional collaboration, technology scouting and knowledge creation.

Skills

semiconductor packaging

assembly & test tech

BE processes

stakeholder management

Education

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, Physics)

Job description

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Principal Engineer Package Technology, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your role

Key responsibilities in your new role

In this role, you will lead the definition, design, and development of semiconductor packaging solutions from concept and feasibility studies through to realization, ensuring they meet electrical, thermal, mechanical, reliability, and business requirements. You will serve as the technical expert and consultant for package design and assembly technologies, driving innovation, cross-functional collaboration, technology scouting, and knowledge creation through technical publications and patent development.

• Define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realization
• Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc.) activities for package projects with major changes/new package, risks and impact
• Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed
• Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements
• Be the contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how
• Support pre development & project definition stage, and continue to be package design expert throughout project phase
• Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons
• Be the main contact person and technical consultant/coach for all questions and discussion regarding packaging, package design and Package
• Drive innovation and pre development activities within the package platform
• Consolidate the inputs for BDR and ensure the contents are updated (A project)
• Generate technical papers / journals and patents related to package technology

Your profile

Qualifications And Skills To Help You Succeed

You strive to leverage deep expertise in semiconductor packaging, assembly, and test technologies, with a strong understanding of BE processes, materials, package reliability, and quality requirements to develop robust and innovative packaging solutions. You demonstrate strong analytical, communication, negotiation, and stakeholder management skills, enabling effective cross-functional collaboration and the successful resolution of complex technical and business challenges.

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, Physics)
• At least >10 years of working experience in IC/semiconductor environment
• Experience in Semiconductor Packaging, Assembly and Test
• Excellent technical knowledge of BE processes and materials in plastic packages and interaction to the different functions (interaction of BOM, package construction, design rules and process)
• Good understanding of Automotive quality requirements and standards
• Good knowledge on the internal package analysis and first level reliability
• Strong analytical skills, ability to deal with conflict and ambiguity
• Strong communication, negotiation skills and stakeholder management skills across all levels
• Good knowledge on flip-chip technology would be advantageous

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.