Remote Package Design Engineer for AI HPCs

Spd-Technology; México; Remote; MXN 600,000 - 900,000; Full time

Job summary

Spd-Technology seeks a seasoned Package Design Engineer to push the boundaries of semiconductor packaging. You will develop substrates for 2.5D/3.5D packaging, collaborating with SI/PI, thermal, mechanical, and PCB teams to ensure high performance and reliability across data center scale systems.

The role emphasizes end-to-end design, from routing feasibility studies to manufacturing documentation, with a focus on PPA optimization and TCO reduction.

Qualifications

• Bachelor's degree in Mechanical Engineering or related field, or equivalent practical experience.
• 8+ years of experience in chip package substrate design using Cadence APD or Mentor Expedition.
• Experience in chip package substrate layout, design verification, DFM and production tape-out.
• Experience in design automation and scripting.
• English proficiency: Upper Intermediate or higher.

Responsibilities

• Develop physical package substrate design for large form-factor packages used in ML HPCs.
• Define the CAD flow and methodology for efficient substrate design and productivity.
• Lead co-design initiatives across chip, package, and system levels with production sign-off.
• Collaborate with SI/PI, thermal and mechanical teams to refine product package designs and test vehicles.
• Document requirements for package substrate design and BOM.

Skills

Cadence APD

Mentor Expedition

English (Upper Intermediate)

Education

Bachelor's degree in Mechanical Engineering

Tools

Cadence APD

Mentor Expedition

Job description

Spd-Technology seeks a seasoned Package Design Engineer to push the boundaries of semiconductor packaging. You will develop substrates for 2.5D/3.5D packaging, collaborating with SI/PI, thermal, mechanical, and PCB teams to ensure high performance and reliability across data center scale systems.

The role emphasizes end-to-end design, from routing feasibility studies to manufacturing documentation, with a focus on PPA optimization and TCO reduction.