MEMS Sensor & ASIC Design Engineer

Honeywell Aerospace; Piemonte; On-site; EUR 30,000 - 36,000; Full time

Job summary

Civitanavi Systems, now part of the Honeywell group, is seeking a MEMS and ASIC Designer to join the Turin or Porto Sant’Elpidio team. You will design, model and test MEMS sensors and their packaging, collaborating with ASIC, FPGA, PCB and software engineers to integrate MEMS into CNS systems.

The ideal candidate holds a Master’s degree in Electronics or related fields, has experience with MEMS development, packaging constraints and verification plans, and communicates effectively in English.

Qualifications

• Master’s degree in Electronics, Microelectronics, Physics, Materials Science or a related discipline.
• Experience in MEMS development.
• Knowledge of MEMS packaging technologies and constraints.
• Ability to deliver results within schedule, quality and cost constraints.
• Good written and spoken English; knowledge of additional languages is a plus.

Responsibilities

• Join HW team and collaborate with ASIC, system, FPGA, PCB, firmware, software, packaging, process and test engineers.
• Translate product and system requirements into MEMS sensor and package specifications.
• Design, model and simulate control loops of MEMS sensing structures.
• Define and develop package concepts for MEMS devices with mechanical and thermal considerations.
• Coordinate interfaces with foundries, packaging suppliers and assembly partners.
• Define and support verification plans, prototype characterization and reliability testing.
• Contribute to design reviews, risk analysis and design-for-manufacturing activities.
• Generate and maintain sensor and package design documentation and requirements traceability.

Skills

MEMS sensing principles

Finite-element modeling

Multidisciplinary teamwork

English proficiency

Education

Master’s degree in Electronics or related field

Job description

Civitanavi Systems, now part of the Honeywell group, is seeking a MEMS and ASIC Designer to join the Turin or Porto Sant’Elpidio team. You will design, model and test MEMS sensors and their packaging, collaborating with ASIC, FPGA, PCB and software engineers to integrate MEMS into CNS systems.

The ideal candidate holds a Master’s degree in Electronics or related fields, has experience with MEMS development, packaging constraints and verification plans, and communicates effectively in English.