MEMS Engineer (m/f/d)

Honeywell Aerospace; Piemonte; In loco; EUR 30.000 - 36.000; Tempo pieno

Descrizione del lavoro

Civitanavi Systems, now part of the Honeywell group, is seeking a MEMS and ASIC Designer to join the Turin or Porto Sant’Elpidio team. You will design, model and test MEMS sensors and their packaging, collaborating with ASIC, FPGA, PCB and software engineers to integrate MEMS into CNS systems.

The ideal candidate holds a Master’s degree in Electronics or related fields, has experience with MEMS development, packaging constraints and verification plans, and communicates effectively in English.

Competenze

• Master’s degree in Electronics, Microelectronics, Physics, Materials Science or a related discipline.
• Experience in MEMS development.
• Knowledge of MEMS packaging technologies and constraints.
• Ability to deliver results within schedule, quality and cost constraints.
• Good written and spoken English; knowledge of additional languages is a plus.

Mansioni

• Join HW team and collaborate with ASIC, system, FPGA, PCB, firmware, software, packaging, process and test engineers.
• Translate product and system requirements into MEMS sensor and package specifications.
• Design, model and simulate control loops of MEMS sensing structures.
• Define and develop package concepts for MEMS devices with mechanical and thermal considerations.
• Coordinate interfaces with foundries, packaging suppliers and assembly partners.
• Define and support verification plans, prototype characterization and reliability testing.
• Contribute to design reviews, risk analysis and design-for-manufacturing activities.
• Generate and maintain sensor and package design documentation and requirements traceability.

Conoscenze

MEMS sensing principles

Finite-element modeling

Multidisciplinary teamwork

English proficiency

Formazione

Master’s degree in Electronics or related field

Descrizione del lavoro

Job Description

Civitanavi Systems is a leading player in the design, development and manufacture high-tech solutions of Navigation, Control and Stabilization Systems, for several applications, in Aerospace Defense and Industrial sectors. The application of proprietary methods and technologies, based on FOG (Fiber Optic Gyroscope) and MEMS (Micro Electro-Mechanical Systems) technology, enables the company to best meet the specific needs of its customers.

Founded as a start-up in 2012 in Italy and recognized as an innovative SME in 2017, Civitanavi has joined the Honeywell Group as of August 2025.

Our MEMS team is looking for a MEMS and ASIC Designer to join the company in the Turin’s office or headquarter in Porto Sant’Elpidio, and take responsibility for the design, development, test and integration of MEMS sensors to be embedded transversally in CNS’ systems. This opportunity is addressed to engineers with a background in Electronics or equivalent scientific background.

Responsibilities

• The selected candidate will join the HW team working on MEMS-based products and will collaborate with ASIC, system, FPGA, PCB, firmware, software, packaging, process and test engineers.
• Translate product and system requirements into MEMS sensor and package specifications, architectures and verifiable design requirements.
• Design, model and simulate control loops of MEMS sensing structures.
• Desing the analog circuits to control the MEMS sensor.
• Define and develop package concepts for MEMS devices, considering mechanical support, stress management, thermal behavior, vacuum or controlled atmosphere, interconnections, sealing, contamination control and compatibility with assembly processes.
• Assess the interaction between MEMS structures and package through mechanical, thermal and multiphysics modeling, and drive sensor-package co-design to minimize performance degradation.
• Coordinate interfaces with foundries, packaging suppliers and assembly partners, supporting process selection, design rules, tolerancing, prototype fabrication and industrialization.
• Define and support verification plans, prototype characterization, environmental and reliability testing, failure analysis and interpretation of results at die, package and product level.
• Contribute to design reviews, risk analysis, design-for-manufacturing, design-for-test, yield improvement and qualification activities.
• Generate and maintain sensor and package design documentation, models, interface specifications, verification reports and requirements traceability.

Qualifications

• Master’s degree in Electronics, Microelectronics, Physics, Materials Science or a related discipline, with relevant experience in MEMS development.
• Knowledge of MEMS sensing principles, micromechanics, electrostatic or other transduction mechanisms, and the main performance and error sources of MEMS sensors.
• Experience in the design, modeling and simulation of control loops for MEMS structures using finite-element, multiphysics and dedicated MEMS design tools.
• Knowledge of microfabrication technologies, materials, process design rules, tolerances and their impact on sensor performance, yield and reliability.
• Knowledge of MEMS packaging technologies and constraints, including die attach, bonding, interconnections, sealing, cavity or vacuum packages, thermo-mechanical stress, outgassing and reliability.
• Ability to perform sensor-package co-design and to evaluate the interaction of the MEMS device with ASICs, electronics, assembly processes and the operating environment.
• Familiarity with laboratory instrumentation, prototype characterization, environmental testing, statistical analysis and failure-analysis techniques.
• Ability to work autonomously and within multidisciplinary teams, with a structured approach to problem solving and requirements management.
• Ability to deliver results within schedule, quality and cost constraints.
• Good written and spoken English; knowledge of additional languages is a plus.

Annual gross salary from 33.058,74€ and applicable NCBA is Metalmeccanico (Contratto Collettivo Nazionale di Lavoro per i dipendenti delle industrie metalmeccaniche private e della installazione di impianti); The salary we're displaying represents only the minimum wage according to CLA applied. Final salary offer will depend on your experience and qualifications and are also based on objective and gender-neutral criteria. Incentives and benefits to be part of the offer.

We are an equal opportunity employer and value diversity at our company. We do not discriminate based on race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform crucial job functions, and to receive other benefits and privileges of employment. Please contact us to request accommodation.